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author:

Gao, Chenghui (Gao, Chenghui.) [1] (Scholars:高诚辉) | Yao, Ligang (Yao, Ligang.) [2] (Scholars:姚立纲) | Liu, Ming (Liu, Ming.) [3] (Scholars:刘明)

Indexed by:

EI Scopus SCIE

Abstract:

Instrumented indentation was used to investigate the proportional relationships among indentation variables such as the maximum indentation displacement, contact depth, the ratio of load over contact stiffness, and the ratio of permanent displacement over the maximum displacement. Material and indenter were borosilicate K9 glass and a Berkovich indenter, respectively. Results of fused silica under the same indenter were compared. Load-displacement curves of K9 glass were characterized by power-law functions for both loading (power exponent of 2) and unloading (power exponent of 1.36) with hardness, elastic modulus, yield stress, and power strain hardening exponent being 7.72, 82.8, 3.5 GPa, and 0.6, respectively. Experimental results were found to be in agreement with theoretical prediction and dimensional analysis. The results calculated from energy-based method were found to be consistent with those based on Oliver and Pharr's method. General implications of the scaling relations for indentation variables were discussed (e.g., the scaling expressions can be used to check indentation data). (C) 2018 Society of Photo-Optical Instrumentation Engineers (SPIE).

Keyword:

Berkovich nanoindentation borosilicate K9 glass indentation analysis mechanical properties scaling relationships

Community:

  • [ 1 ] [Gao, Chenghui]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou, Fujian, Peoples R China
  • [ 2 ] [Yao, Ligang]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou, Fujian, Peoples R China
  • [ 3 ] [Liu, Ming]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou, Fujian, Peoples R China

Reprint 's Address:

  • 刘明

    [Liu, Ming]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou, Fujian, Peoples R China

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Source :

OPTICAL ENGINEERING

ISSN: 0091-3286

Year: 2018

Issue: 3

Volume: 57

1 . 2 0 9

JCR@2018

1 . 1 0 0

JCR@2023

ESI Discipline: ENGINEERING;

ESI HC Threshold:170

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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