The　adhesion/cohesion　of　plasma-sprayed　coatings　depends　strongly　on　the　flattening　and　solidification　of　individual　splat,　taking　place　in　a　few　microseconds.　Such　a　short　time　makes　it　difficult　to　thoroughly　study　the　splat　formation.　A　three-dimensional　numerical　model　incorporating　the　substrate　melting　and　solidification　was　developed　using　CFD　method　to　simulate　the　flattening　and　cooling　of　zirconia　splat　involving　the　influence　of　interface　thermal　contact　resistance.　On　smooth　substrate　where　the　thermal　contact　resistance　is　zero,　the　splat　has　a　cooling　rate　of　1.7　x　10(8)　K/s,　resulting　in　substrate　melting,　and　a　disk-like　splat　is　formed　with　a　spread　factor　of　approximately　3.5.　While　on　substrate　with　thermal　contact　resistance　of　10(-7)　m(2)　K/W,　corresponding　cooling　rate　is　3.17　x　10(8)　K/s　and　a　central　splat　surrounded　by　satellite　droplets　is　formed　due　to　the　rapid　solidification　of　the　splat　edges.