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author:

Bharathi, B. (Bharathi, B..) [1] | Thanikaikarasan, S. (Thanikaikarasan, S..) [2] | Chandrasekar, P. V. (Chandrasekar, P. V..) [3] | Kollu, Pratap (Kollu, Pratap.) [4] | Mahalingam, T. (Mahalingam, T..) [5] | Ixtlilco, Luis (Ixtlilco, Luis.) [6]

Indexed by:

EI Scopus SCIE

Abstract:

Thin films of NiS have been deposited on indium doped tin oxide coated conducting glass substrates using electrodeposition technique. Structural studies revealed that the deposited films exhibit hexagonal structure with preferential orientation along (002) plane. Structural parameters such as crystallite size, strain and dislocation density are calculated for films with different thickness values obtained at various deposition time. The film composition and surface morphology have been analyzed using scanning electron microscopy and energy dispersive analysis by X-rays. Optical absorption analysis showed that the deposited films possess band gap value around 0.7 eV.

Keyword:

Electrodeposition NiS Semiconductor Thin Films

Community:

  • [ 1 ] [Bharathi, B.]PSN Coll Engn & Technol, Sch Basic Engn & Sci, Ctr Sci & Appl Res, Tirunelveli 627152, Tamil Nadu, India
  • [ 2 ] [Thanikaikarasan, S.]PSN Coll Engn & Technol, Sch Basic Engn & Sci, Ctr Sci & Appl Res, Tirunelveli 627152, Tamil Nadu, India
  • [ 3 ] [Chandrasekar, P. V.]Fuzhou Univ, Inst Optoelect Display, Coll Phys & Informat Engn, Fuzhou 350002, Peoples R China
  • [ 4 ] [Kollu, Pratap]Indian Inst Technol, Dept Met Engn & Mat Sci, DST INSPIRE Fac, Mumbai 400076, Maharashtra, India
  • [ 5 ] [Mahalingam, T.]Ajou Univ, Dept Elect & Comp Engn, Suwon 443749, South Korea
  • [ 6 ] [Ixtlilco, Luis]Univ Politecn Estado Guerrero, Taxco 40290, Guerrero, Mexico

Reprint 's Address:

  • [Thanikaikarasan, S.]PSN Coll Engn & Technol, Sch Basic Engn & Sci, Ctr Sci & Appl Res, Tirunelveli 627152, Tamil Nadu, India

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Source :

JOURNAL OF NEW MATERIALS FOR ELECTROCHEMICAL SYSTEMS

ISSN: 1480-2422

Year: 2014

Issue: 3

Volume: 17

Page: 167-171

0 . 5 1 1

JCR@2014

0 . 7 0 0

JCR@2023

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:355

JCR Journal Grade:4

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 3

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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