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author:

Zhang, Miao (Zhang, Miao.) [1] | Yang, Fufu (Yang, Fufu.) [2] (Scholars:杨富富) | Ma, Jiayao (Ma, Jiayao.) [3] | Chen, Yan (Chen, Yan.) [4] | You, Zhong (You, Zhong.) [5]

Indexed by:

CPCI-S

Abstract:

Resch patterns have a great potential to be utilized in many engineering applications, as they can be folded into curved profiles from planar sheets. They are rigid foldable but with a large number of degrees of freedom (DOF) when there are many units tessellating in the patterns, which constrains the applications due to the difficulty in control the motion symmetrically. In this paper, in order to achieve the single mobility for a limited number of triangular Resch pattern units, the thick-panel technique is employed at each vertex to reduce the DOF to one. Then the compatibility among all the vertices has to be satisfied by the systematical kinematic analysis on the geometric parameters of the Resch pattern and panel thickness. Eventually, two design schemes are obtained to form the one DOF origami structure with doubly-curved intermediate folding configurations, which could be further tessellated into a large pattern for various engineering applications.

Keyword:

plane-symmetric Bricard linkage Six-crease Resch patterns thick-panel origami threefold-symmetric Bricard linkage

Community:

  • [ 1 ] [Zhang, Miao]Tianjin Univ, Sch Mech Engn, Tianjin 300072, Peoples R China
  • [ 2 ] [Ma, Jiayao]Tianjin Univ, Sch Mech Engn, Tianjin 300072, Peoples R China
  • [ 3 ] [Chen, Yan]Tianjin Univ, Sch Mech Engn, Tianjin 300072, Peoples R China
  • [ 4 ] [Yang, Fufu]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Fujian, Peoples R China
  • [ 5 ] [You, Zhong]Univ Oxford, Dept Engn Sci, Oxford OX1 3PJ, England

Reprint 's Address:

  • [Chen, Yan]Tianjin Univ, Sch Mech Engn, Tianjin 300072, Peoples R China

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Source :

PROCEEDINGS OF THE ASME INTERNATIONAL DESIGN ENGINEERING TECHNICAL CONFERENCES AND COMPUTERS AND INFORMATION IN ENGINEERING CONFERENCE, 2018, VOL 5B

Year: 2018

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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