0.1wt%　RE　and　0.2wt%~0.8wt%　Ni　were　added　into　Zn20Sn　high-temperature　lead-free　solders.　The　effects　of　RE　and　Ni　additions　on　the　microstructure　and　properties　of　the　solder　alloys　were　investigated.　The　results　show　that　the　solidus　temperature　of　solder　alloys　is　not　distinctly　affected　when　the　0.1　wt%　RE　and　0.2wt%~0.8wt%　Ni　are　added　into　Zn20Sn　solder　alloys,　whereas　the　liquidus　temperature　decreases,　the　wettability　and　microhardness　significantly　improve.　The　solder　alloy　shows　the　best　wettability　and　the　highest　microhardness　when　the　content　of　RE　is　0.1wt%　and　Ni　is　0.4wt%.　Ni-containing　intermetallic　compounds　form　in　solder　alloys　and　the　amount　of　intermetallic　compounds　gradually　increases　with　increasing　Ni　content,　and　the　shape　of　intermetallic　compounds　and　the　microstructure　of　solder　alloys　change　markedly.　©　2018,　Northwest　Institute　for　Nonferrous　Metal　Research.　Published　by　Elsevier　BV.　All　rights　reserved.