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author:

Marvel, C.J. (Marvel, C.J..) [1] | Kracum, M.R. (Kracum, M.R..) [2] | Yu, Z. (Yu, Z..) [3] | Harmer, M.P. (Harmer, M.P..) [4] | Chan, H.M. (Chan, H.M..) [5]

Indexed by:

EI

Abstract:

Alumina powders were processed with 7.8 wt% CuO and post-sintering reduction heat-treatments were applied with the aim of producing metallic grain boundary complexions. The influence of titanium co-doping was also studied. Grain boundaries were characterized by aberration-corrected scanning transmission electron microscopy. Copper grain boundary enrichment was achieved, but only in the titanium doped samples; the segregated copper exhibited a Cu2+ valency state, the segregated titanium exhibited Ti3+ or Ti4+ valency states, and metallic Cu nanoparticles were also observed. The crystallographic orientation of the grain boundary plane had a marked influence on concentration and oxidation state of the segregating species. © 2018

Keyword:

Alumina Aluminum oxide Copper Copper oxides Grain boundaries High resolution transmission electron microscopy Metal complexes Nanoparticles Reduction Scanning electron microscopy Sintered alumina Sintering Titanium

Community:

  • [ 1 ] [Marvel, C.J.]Department of Materials Science and Engineering, Lehigh University, Bethlehem; PA; 18015, United States
  • [ 2 ] [Kracum, M.R.]Department of Materials Science and Engineering, Lehigh University, Bethlehem; PA; 18015, United States
  • [ 3 ] [Yu, Z.]State Key Laboratory of Photocatalysis on Energy and Environment, College of Chemistry, Fuzhou University, Fuzhou; 350002, China
  • [ 4 ] [Harmer, M.P.]Department of Materials Science and Engineering, Lehigh University, Bethlehem; PA; 18015, United States
  • [ 5 ] [Chan, H.M.]Department of Materials Science and Engineering, Lehigh University, Bethlehem; PA; 18015, United States

Reprint 's Address:

  • [chan, h.m.]department of materials science and engineering, lehigh university, bethlehem; pa; 18015, united states

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Source :

Scripta Materialia

ISSN: 1359-6462

Year: 2018

Volume: 157

Page: 34-38

4 . 5 3 9

JCR@2018

5 . 3 0 0

JCR@2023

ESI HC Threshold:284

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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