The　polyimide　(PI)　coatings　were　grown　by　vapor　deposition　polymerization　(VDP)　with　biphenyltetracarboxylic　dianhydride　and　4,　4＇-diaminodiphenyl　ether　as　the　reactive　monomers.　The　influencing　growth　factors,　including　the　thermal　imine　temperature,　pressure,　and　etc.,　were　evaluated.　The　microstructures　and　properties　of　the　PI　films　were　characterized　with　Fourier　transform　infrared　spectroscopy,　X-ray　photoelectron　spectroscopy,　energy　dispersive　spectroscopy,　scanning　electron　microscopy,　and　atomic　force　microscopy.　The　results　show　that　the　PI　film　has　good　electrical　properties　and　high　thermal　stability.　For　instance,　after　thermal　imine　processing　at　300°C　for　1　hour　at　a　pressure　of　1.0×10-2　Pa,　the　fairly　compact　insulating　PI　membrane　displays　a　high　breakdown　voltage,　8.42　MV/cm,　and　a　low　leakage　current,　8.2×10-5　A/cm2,　at　a　field　of　8.0　MV/cm.