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author:

Fu, G.S. (Fu, G.S..) [1] | Chen, W.Z. (Chen, W.Z..) [2] | Qian, K.W. (Qian, K.W..) [3]

Indexed by:

EI Scopus

Abstract:

The behavior of flow stress of Al sheets used for pressure can prepared by different melt-treatment during plastic deformation at elevated temperature was studied by isothermal compression test using Gleeble 1500 dynamic hot-simulation testing machine. The results show that the Al sheets possess the remarkable characteristic of steady state flow stress when they are deformed in the temperature range of 350°C-500°C at strain rates within the range of 0.01-10.0 s-1. A hyperbolic sine relationship is found to correlate well the flow stress with the strain rate, and an Arrhenius relationship with the temperature, which implies that the process of plastic deformation at elevated temperature for this material is thermally activated. Compared with the Al pieces prepared without such melt-treatment or by conventional melt-treatment, hot deformation activation energy of Al sheets prepared by high-efficient melt-treatment is the smallest (Q=168.0 kJ/mol), which reveals that the hot working formability of this material is far better, and has directly to do with the effective improvement of its metallurgical quality.

Keyword:

Activation energy Aluminum sheet Computer simulation Dynamics Melting Plastic deformation Pressure Pressure vessels Steady flow Strain rate Stresses Temperature

Community:

  • [ 1 ] [Fu, G.S.]School of Mechanical Engineering, Fuzhou University, Fuzhou 350002, China
  • [ 2 ] [Chen, W.Z.]School of Mechanical Engineering, Fuzhou University, Fuzhou 350002, China
  • [ 3 ] [Qian, K.W.]School of Mechanical Engineering, Fuzhou University, Fuzhou 350002, China

Reprint 's Address:

  • 傅高升

    [fu, g.s.]school of mechanical engineering, fuzhou university, fuzhou 350002, china

Email:

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Source :

Acta Metallurgica Sinica (English Letters)

ISSN: 1006-7191

CN: 21-1361/TG

Year: 2005

Issue: 6

Volume: 18

Page: 756-762

2 . 9 0 0

JCR@2023

ESI Discipline: MATERIALS SCIENCE;

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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