Influences of process parameters of low frequency PECVD technology on intrinsic stress of silicon nitride thin film - Details

author：

Li, Weizhi (Li, Weizhi.) ^[1] | Kang, Zhe (Kang, Zhe.) ^[2] | Ye, Yun (Ye, Yun.) ^[3] | Jiang, Yadong (Jiang, Yadong.) ^[4]

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Abstract：

Silicon　nitride　(SiNx)　thin　films　were　deposited　by　low　frequency　(LF)　plasma　enhanced　chemical　vapor　deposition　(PECVD)　technology.　By　systematic　variation　of　the　process　parameters,　e.g.　reactive　gas　flow　rate,　LF　power,　chamber　gas　pressure　and　substrate　temperature.　Influences　of　above　parameters　on　the　intrinsic　stress　of　SiNx　films　were　studied　and　analyzed　by　combining　with　the　measured　refractive　index　(RI),　density,　infrared　spectra　results　of　deposited　SiNx　films.　The　results　showed　that　intrinsic　stress　of　SiNx　film　was　roughly　proportional　to　film　density,　which　was　inversely　proportional　to　hydrogen　content　in　the　SiNx　film.　Substrate　temperature　during　deposition　was　the　most　important　factor　affecting　hydrogen　content　in　deposited　film　and,　accordingly,　the　density　and　intrinsic　stress　of　SiNx　film.　©　2010　Copyright　SPIE　-　The　International　Society　for　Optical　Engineering.

Keyword：

Display devices Energy conversion Flow of gases Hydrogen Nitrides Optoelectronic devices Plasma CVD Plasma enhanced chemical vapor deposition Refractive index Silicon nitride Spectroscopy Stresses Substrates Thin films

Community：

[ 1 ] [Li, Weizhi]State Key Lab. of Electronic Materials and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan Province, China
[ 2 ] [Kang, Zhe]State Key Lab. of Electronic Materials and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan Province, China
[ 3 ] [Ye, Yun]Field Emission Display Technology Engineering Research Center, Ministry of Education, Fuzhou University, Fuzhou, Fujian Province, China
[ 4 ] [Jiang, Yadong]State Key Lab. of Electronic Materials and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan Province, China

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Email：

leewz@uestc.edu.cn

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Source ：

ISSN： 0277-786X

Year： 2010

Volume： 7658

Language： English

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SCOPUS Cited Count： 5

ESI Highly Cited Papers on the List： 0 Unfold All

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30 Days PV： 0

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