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Abstract：
A dual parameter on-chip test platform (- tester) based on thermal actuator is introduced in this paper, used to extract static tensile fracture strength and dynamic impact bending fracture strength. Process quality can be evaluated based on the extracted fracture strength parameters. The tester has the characteristics of quantifiable readout without relying on precision equipment. This paper describes the structure and manufacturing process of the tester. It is found in scanning electron microscope (SEM) picture of the tester that there is line width loss during the etching process, which had an important influence on test results. The test results show that the tester successfully achieves quality inspection of the micro-beam, and achieves accurate detection and extraction of static tensile fracture strength and impact bending fracture strength. © 2018 IEEE.
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2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2018 - Proceedings
Year： 2018
Language： English
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ESI Highly Cited Papers on the List： 0 Unfold All
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30 Days PV： 2
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