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author:

Zuo, J. (Zuo, J..) [1] | Lin, Y. (Lin, Y..) [2] | Zheng, J. (Zheng, J..) [3] | Zhong, P. (Zhong, P..) [4] | He, M. (He, M..) [5]

Indexed by:

Scopus

Abstract:

In this paper, a comparative study is reported on tool wear morphology described by machining Be/Cu alloy at different cutting speed:200 m/min,400 m/min,600 m/min,800 m/min and 1000 m/min. The cemented tungsten carbide tools, both coated with TiAlN, are used to test tool life, and the flank wear extent and standard deviation are adopted to describe surface wear pattern. In order to explain the wear mechanism under different cutting speed, a series of theoretical calculation and experiment results were listed in this paper to explain adhesive effect on tool wear under different surface pressure, and results show that the adhesions and wear patterns would be affected by cutting speed and surface pressure. Comparing the relationship between cutting force, cutting heat, surface elements and tool wear, we can easily find out that the hard particle such as Cu and Be adhered to cutting edge to affect tool geometry and strengthen. Besides, the microstructure and generation probability are analyzed to discuss the crystal surface slipping effect on tool wear. © 2019

Keyword:

Adhesive effect; Beryllium-copper alloy; Dry milling; TiAlN; Wear

Community:

  • [ 1 ] [Zuo, J.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, China
  • [ 2 ] [Lin, Y.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, China
  • [ 3 ] [Zheng, J.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, China
  • [ 4 ] [Zhong, P.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, China
  • [ 5 ] [He, M.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, China

Reprint 's Address:

  • [Lin, Y.]School of Mechanical Engineering and Automation, Fuzhou UniversityChina

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Source :

Vacuum

ISSN: 0042-207X

Year: 2019

Volume: 167

Page: 271-279

2 . 9 0 6

JCR@2019

3 . 8 0 0

JCR@2023

ESI HC Threshold:236

JCR Journal Grade:2

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 15

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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