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author:

Guan, X. (Guan, X..) [1] | Qin, J. (Qin, J..) [2] | Shu, N. (Shu, N..) [3] | Peng, H. (Peng, H..) [4]

Indexed by:

Scopus

Abstract:

Overheating faults of gas-insulated bus (GIB) plug-in connectors induced by contact degradation seriously threaten the safe operation of equipment and power system. Multiphysics coupled numerical simulations and physical experiments were conducted in this article to reveal contact degradation processes of the GIB plug-in connector. First, electromagnetic-thermal-mechanical coupled finite-element (FE) model was built. Relative motion between contact interfaces was considered by low-velocity Stribeck friction model. FE model was verified by physical experiment. Second, influences of operation current, spring stiffness, and conductor insert depth on contact temperature rise were analyzed. Results show that insufficient conductor could induce overheating on several contact spots then accelerate the degradation process. Third, thermal and motion characteristics under cyclic operation currents and short-circuit (SC) current impact were analyzed. Results show that conductor insert depth could be changed by relative motion between contact elements. Relative motion accumulates gradually under cyclic thermal loading by operation current. Significant relative motion and temperature rise could be induced by SC current impact. Finally, progressive and sudden failure mechanisms of the GIB plug-in connector were discussed. Research result may guide optimal design and field maintenance of GIB equipment, and thus improves its reliability. © 2011-2012 IEEE.

Keyword:

Contact failure; finite-element (FE) methods; friction; gas-insulated bus (GIB); plug-in connector; short-circuit (SC) currents

Community:

  • [ 1 ] [Guan, X.]College of Electrical Engineering and Automation, Fuzhou University, Fuzhou, 350108, China
  • [ 2 ] [Guan, X.]School of Electrical Engineering, Wuhan University, Wuhan, 430072, China
  • [ 3 ] [Qin, J.]State Grid Chengdu Power Supply Company, Chengdu, 611000, China
  • [ 4 ] [Shu, N.]School of Electrical Engineering, Wuhan University, Wuhan, 430072, China
  • [ 5 ] [Peng, H.]School of Electrical Engineering, Wuhan University, Wuhan, 430072, China

Reprint 's Address:

  • [Guan, X.]College of Electrical Engineering and Automation, Fuzhou UniversityChina

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Source :

IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSN: 2156-3950

Year: 2019

Issue: 9

Volume: 9

Page: 1776-1784

1 . 8 8 9

JCR@2019

2 . 3 0 0

JCR@2023

ESI HC Threshold:150

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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