In　the　past　60　years,　integrated　circuits　have　been　developing　in　the　direction　of　smaller　size　and　higher　integration　under　the　guidance　of　Moore＇s　law.　However,　the　heat　dissipation　problem　of　the　chip　becomes　prominent　as　the　chip　size　decreases　and　the　integration　degree　increases.　Therefore,　this　paper　presents　a　manifold　microchannel　interposer　based　on　advanced　packaging　technology.　Compared　with　traditional　heat　sink,　the　interposer　has　high　heat　dissipation　performance,　low　flow　resistance,　strong　compatibility　with　IC　and　small　thickness.　The　micro-channel　structure　of　the　heat　sink　optimized　by　COMSOL™　simulation　software　and　fabricated　by　etching,　photolithography,　silicon-silicon　direct　bonding,　thin　polishing　and　other　microelectromechanical　systems　(MEMS).　A　stable　and　reliable　thermal　testing　system　is　designed　and　tested　for　the　thermal　testing　of　heat　sink.　The　test　results　show　that　when　the　input　flow　rate　is　40　ml/min,　the　heat　dissipation　capacity　can　reaches　550　W/cm2,　and　the　chip　surface　temperature　is　only　128　□.　©　2019　IEEE.