Preparation and Study of HA-CS-Mineralized Collagen Gel - Details

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Abstract：

A　hydrogel　is　a　novel　high　molecular　polymer　that　forms　a　three-dimensional　network　structure　by　polymer　chemical　or　physical　cross-linking.　In　this　experimental　study,　a　chitosan-hyaluronic　acid　gel　was　used　as　a　carrier,　and　nano-hydroxyapatite/collagen　was　composited　to　prepare　a　gel-based　composite　for　3D　bio-printing.　The　properties　of　the　composite　gel　were　analyzed　by　in　vitro　gel　test,　rheological　analysis,　infrared　spectroscopy　and　scanning　electron　microscopy.　The　results　showed　that　the　chitosan-hyaluronic　acid　gel　with　different　mineralized　collagen　concentrations　could　be　gelled　rapidly　at　37　°C　for　5　min.　Rheology　experiments　show　that　CS-HA　mineralized　collagen　has　shear　thinning　characteristics　suitable　for　3D　bio-printing.　The　hydrogel　was　observed　to　have　a　cross-linked　morphology　by　scanning　electron　microscopy,　and　the　porous　structure　was　good.　Has　a　high　biomedical　re-research　value　and　use　value.　©　2019,　Springer　Nature　Singapore　Pte　Ltd.

Keyword：

3D bioprinting; Chitosan; Hyaluronic acid; Hydrogel; Rheology

Community：

[ 1 ] [Hu, M.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 2 ] [Hu, M.]Beijing Engineering Research Center of Printed Electronics, Beijing, China
[ 3 ] [Hu, K.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 4 ] [Hu, K.]Beijing Engineering Research Center of Printed Electronics, Beijing, China
[ 5 ] [Hu, K.]College of Biological Science and Engineering, Fuzhou University, Fujian, China
[ 6 ] [Cui, Y.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 7 ] [Cui, Y.]Beijing Engineering Research Center of Printed Electronics, Beijing, China
[ 8 ] [Yan, J.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 9 ] [Yan, J.]Beijing Engineering Research Center of Printed Electronics, Beijing, China
[ 10 ] [Yang, G.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 11 ] [Yang, G.]Beijing Engineering Research Center of Printed Electronics, Beijing, China
[ 12 ] [Zhu, L.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 13 ] [Zhu, L.]Beijing Engineering Research Center of Printed Electronics, Beijing, China
[ 14 ] [Yan, M.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 15 ] [Yan, M.]Beijing Engineering Research Center of Printed Electronics, Beijing, China
[ 16 ] [Wei, Y.]Department of Chemistry and Tsinghua Center for Frontier Polymer Research, Tsinghua University, Beijing, China
[ 17 ] [Li, L.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 18 ] [Li, L.]Beijing Engineering Research Center of Printed Electronics, Beijing, China
[ 19 ] [Zhang, F.]The First Hospital of Fuzhou Medical Association, Fujian, China

Reprint 's Address：

[Hu, K.]Institute of Printing and Packaging Engineering, Beijing Institute of Graphic CommunicationChina

Email：

kunhu@139.com

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Source ：

Lecture Notes in Electrical Engineering

ISSN： 1876-1100

Year： 2019

Volume： 543

Page： 996-1002

Language： English

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 4

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