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author:

Hu, K. (Hu, K..) [1] | Hu, M. (Hu, M..) [2] | Xiao, Y. (Xiao, Y..) [3] | Cui, Y. (Cui, Y..) [4] | Yan, J. (Yan, J..) [5] | Yang, G. (Yang, G..) [6] | Zhang, F. (Zhang, F..) [7] | Lin, G. (Lin, G..) [8] | Yi, H. (Yi, H..) [9] | Han, L. (Han, L..) [10] | Li, L. (Li, L..) [11] | Wei, Y. (Wei, Y..) [12] | Cui, F. (Cui, F..) [13]

Indexed by:

Scopus

Abstract:

On this basis, a novel recombinant human-like collagen (RHLC)/silk fibroin scaffold material with high porosity and controllable aperture was prepared. The compatibility of osteoblasts (OB) with the blends was tested in vitro. The morphology, adhesion and growth of scaffold cells were observed by scanning electron microscope and laser confocal microscope. Extensive measurements, including 3-[4, 5-dimethylthiazole-2-acyl]-2, 5-diphenyl tetrabrominate assays, intracellular total protein content, and alkaline phosphatase activity assays were performed after 7 days of culture. Survival and protein content increased in RHLC/fibroin stents. LSCM and SEM results confirmed that the cells grew better in the mixed scaffolds than in the pure silk scaffolds, and showed that the cells were easy to adhere and diffuse in the RHLC/silk scaffolds. RHLC/silk fibroin scaffolds are promising biomaterials for bone tissue engineering. © 2020 Wiley Periodicals LLC

Keyword:

biomaterial; fibroin; osteoblasts; RHLC; scaffold

Community:

  • [ 1 ] [Hu, K.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
  • [ 2 ] [Hu, K.]College of Biological Science and Engineering, Fuzhou University, Fuzhou, China
  • [ 3 ] [Hu, M.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
  • [ 4 ] [Xiao, Y.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
  • [ 5 ] [Xiao, Y.]School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
  • [ 6 ] [Cui, Y.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
  • [ 7 ] [Yan, J.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
  • [ 8 ] [Yang, G.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
  • [ 9 ] [Zhang, F.]Department of Neurosurgery, The First Hospital of Fuzhou Medical Association, Fuzhou, China
  • [ 10 ] [Lin, G.]Technology Department, FuJian HuaRui Biological Technology Co., Ltd, Fuzhou, China
  • [ 11 ] [Yi, H.]Technology Department, Tsinghua Redbud Innovation Institute Baodi Tianjin, Tianjin, China
  • [ 12 ] [Han, L.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
  • [ 13 ] [Li, L.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
  • [ 14 ] [Wei, Y.]Department of Chemistry and Tsinghua Center for Frontier Polymer Research, Tsinghua University, Beijing, China
  • [ 15 ] [Cui, F.]School of Materials Science and Engineering, Tsinghua University, Beijing, China

Reprint 's Address:

  • [Hu, K.]Beijing Engineering Research Center of Printed Electronics, Institute of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, College of Biological Science and Engineering, Fuzhou University, Department of Neurosurgery, The First Hospital of Fuzhou Medical AssociationChina

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Source :

Journal of Biomedical Materials Research - Part A

ISSN: 1549-3296

Year: 2020

4 . 3 9 6

JCR@2020

3 . 9 0 0

JCR@2023

ESI HC Threshold:196

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 14

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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