The　novel　type　of　electrode,　fabricated　with　the　Ag-based　Cr/Cu/Ag/Cu/Cr　composite　layers　deposited　by　DC　magnetron　sputtering　and　by　lithography,　was　developed.　The　microstructures　and　properties　of　the　composite　layers,　before　and　after　annealing,　were　characterized　with　X-ray　diffraction,　scanning　electron　microscopy,　and　conventional　surface　probes.　The　impacts　of　the　growth　conditions　on　the　composite　layers　were　evaluated.　We　found　that　while　acting　as　the　oxygen　diffusion　barrier,　the　Cu　layer　improves　the　adhesion　at　the　interface　of　Cr　and　Ag.　Besides,　low　temperature　annealing,　say　500°C,　little　affects　the　resistivity　of　the　electrode　possibly　because　the　Cu　and　Cr　layers　protect　Ag　against　oxidation.　The　results　show　that　the　novel　Cr/Cu/Ag/Cu/Cr　electrode　with　favorable　properties,　such　as　low　resistivity,　high　oxidation　resistance,　good　stability　in　high　temperature　annealing,　especially　in　high　temperature　sealing,　may　be　the　promising　material　in　fabricating　field　emission　flat　display　panel.