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author:

Liu, X. (Liu, X..) [1] | Tang, D. (Tang, D..) [2] | Wen, S. (Wen, S..) [3]

Indexed by:

Scopus

Abstract:

Immersion tin (I-Sn) coatings on copper were prepared in a stannous methanesulfonate bath with thiourea being the potential altering agent. The electrochemical displacement process was studied by the galvanic couple current method (GCCM) on an electrochemical workstation. The morphology of the I-Sn coatings were observed by field-emission-gun scanning electron microscopy (FEG-SEM). The I-Sn process can be divided into three stages: (i) rapid increase in galvanic current, (ii) sudden decrease in galvanic current after a peak current, and (iii) low or residual galvanic current stages. It is demonstrated that the galvanic current method is a useful and efficient tool to identify the optimum ending time of the immersion plating process. This optimum immersion time results in a smooth and conformal deposit with a fine grain size. © (2011) Trans Tech Publications, Switzerland.

Keyword:

Galvanic couple current method; Immersion tin plating; Morphology

Community:

  • [ 1 ] [Liu, X.]Institute of Materials Research, Fuzhou University, Fuzhou, Fujian 350000, China
  • [ 2 ] [Liu, X.]Department of Material Science and Engineering, Fujian University of Engineering, Fuzhou, Fujian 350000, China
  • [ 3 ] [Tang, D.]Institute of Materials Research, Fuzhou University, Fuzhou, Fujian 350000, China
  • [ 4 ] [Wen, S.]Department of Mining, Metals and Materials Engineering, McGill University, Montreal, QC H3A 2B2, Canada

Reprint 's Address:

  • [Liu, X.]Institute of Materials Research, Fuzhou University, Fuzhou, Fujian 350000, China

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Source :

Advanced Materials Research

ISSN: 1022-6680

Year: 2011

Volume: 154-155

Page: 1053-1058

Language: English

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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