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author:

Xu, W.C. (Xu, W.C..) [1] | Dai, P.Q. (Dai, P.Q..) [2] | Wu, X.L. (Wu, X.L..) [3] | Tang, D. (Tang, D..) [4]

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Scopus

Abstract:

In the present study, the room temperature mechanical properties of nanocrystalline Ni and Ni-75 wt-%Co alloy, prepared by pulse electrodeposition, were contrasted. Both higher strength and higher ductility were obtained for the Ni-75%Co alloy with a dual phase structure and an average grain size of 7·2 nm. By means of TEM observations of grain structures before and after tensile deformation for Ni and Ni-75%Co samples, a link between the ductility and the variation of stress induced grain growth during tensile deformation was established. Observations of TEM showed stress induced grain growth during tensile deformation, subjected to very high stresses and large strains, is very insignificant for the Ni-75%Co alloy in sharp contrast to the significant stress induced grain growth occurring in Ni. It was proposed that suppression of stress induced grain growth during tensile deformation can delay and even prohibit formation of shear banding plastic instability and thus enhances uniform strain leading to an enhanced ductility. © 2011 Institute of Materials, Minerals and Mining Published by Maney on behalf of the Institute.

Keyword:

Dual phase structure; Grain growth; Mechanical property; Nanocrystalline; Ni-Co; Tensile ductility

Community:

  • [ 1 ] [Xu, W.C.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350108, China
  • [ 2 ] [Dai, P.Q.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350108, China
  • [ 3 ] [Wu, X.L.]State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing, 100080, China
  • [ 4 ] [Tang, D.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350108, China

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Source :

Materials Science and Technology

ISSN: 0267-0836

Year: 2011

Issue: 1

Volume: 27

Page: 320-324

0 . 7 7 2

JCR@2011

1 . 7 0 0

JCR@2023

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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