High-speed　scanning　is　an　effective　way　to　improve　the　throughput　of　immersion　lithography　with　double　patterning,　especially　when　the　critical　dimension　is　less　than　32-nm.　But　it　makes　more　complex　characteristics　of　immersion　flow.　In　this　paper,　considering　the　extreme　speed　of　wafer　scanning,　the　model　is　developed　to　investigate　the　characteristics　of　immersion　flow,　including　the　velocity　vector,　pressure　distribution,　renovation　efficiency　and　so　on.　Finally,　the　optimized　parameters　and　methods　to　effective　liquid　renovation　are　proposed　when　the　wafer　scans　at　high-speed.　©　(2013)　Trans　Tech　Publications,　Switzerland.