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author:

Chang, S.-J. (Chang, S.-J..) [1] | Kuo, D.S. (Kuo, D.S..) [2] | Lam, K.T. (Lam, K.T..) [3] | Wen, K.H. (Wen, K.H..) [4] | Ko, T.K. (Ko, T.K..) [5] | Hon, S.J. (Hon, S.J..) [6]

Indexed by:

Scopus

Abstract:

The authors proposed a simple hot phosphoric etching method to enhance output power of GaN-based light-emitting diodes (LEDs) by 34%. By immersing the sample in H 3PO 4 at 220°C for 40 min, it was found that debris contaminants induced by nanosecond laser scribing could be effectively removed. It was also found that the hot phosphoric etching method will not degrade electrical characteristics of the fabricated LEDs. © 2011 IEEE.

Keyword:

GaN; hot phosphoric etching; laser scribing; light emitting diodes; sapphire substrate

Community:

  • [ 1 ] [Chang, S.-J.]Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan
  • [ 2 ] [Kuo, D.S.]Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan
  • [ 3 ] [Lam, K.T.]College of Physics and Information Engineering, Fuzhou University, Fuzhou 350108, China
  • [ 4 ] [Wen, K.H.]College of Physics and Information Engineering, Fuzhou University, Fuzhou 350108, China
  • [ 5 ] [Ko, T.K.]Nitride Device Research, Development Center, Epistar Corporation, Tainan 744, Taiwan
  • [ 6 ] [Hon, S.J.]Nitride Device Research, Development Center, Epistar Corporation, Tainan 744, Taiwan

Reprint 's Address:

  • [Chang, S.-J.]Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan

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Source :

IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSN: 2156-3950

Year: 2012

Issue: 2

Volume: 2

Page: 349-353

1 . 2 6 1

JCR@2012

2 . 3 0 0

JCR@2023

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 9

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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