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author:

Wei, Z.-L. (Wei, Z.-L..) [1] | Tang, D. (Tang, D..) [2] | Wang, X. (Wang, X..) [3] | You, S.-X. (You, S.-X..) [4]

Indexed by:

Scopus PKU CSCD

Abstract:

In this paper, the characteristic, electrochemistry principle and technological controls of immersion plating depositions were reviewed, which are keen surface technology in electronic field. The applications of the immersion plating depositions as the finishing procedures for printed circuit board (PCB) were shed light upon for immersion tin, immersion gold, immersion palladium and immersion silver. The developing trend and existing problems in the immersion plating were also put forward.

Keyword:

Electrochemical deposit; Immersion plating; Printed circuit board (PCB)

Community:

  • [ 1 ] [Wei, Z.-L.]Institute for Materials Research, Fuzhou University, Fuzhou 350002, China
  • [ 2 ] [Tang, D.]Institute for Materials Research, Fuzhou University, Fuzhou 350002, China
  • [ 3 ] [Wang, X.]Institute for Materials Research, Fuzhou University, Fuzhou 350002, China
  • [ 4 ] [You, S.-X.]Materials Research Center, University of Missouri-Rolla, Rolla, MO 65409, United States

Reprint 's Address:

  • [Wei, Z.-L.]Institute for Materials Research, Fuzhou University, Fuzhou 350002, China

Email:

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Source :

Heat Treatment of Metals

ISSN: 0254-6051

Year: 2005

Issue: SUPPL.

Volume: 30

Page: 262-265

0 . 3 0 4

JCR@2005

0 . 0 0 0

JCR@2006

JCR Journal Grade:3

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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