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author:

谢华 (谢华.) [1] (Scholars:谢华) | 陈文哲 (陈文哲.) [2] | 钱匡武 (钱匡武.) [3]

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CQVIP CSCD

Abstract:

采用薄片弯曲法和压痕法分别研究了热处理温度对化学镀镍层的内应力以及镀层与基体的结合强度的影响规律.结果表明:镀层的内应力为拉应力;当热处理温度为200℃时,内应力减小,镀层经过300、400或600 ℃热处理,内应力逐步增大.随热处理温度升高,镀层与基体的结合力增大.

Keyword:

内应力 化学镀镍 压痕法 结合强度 薄片弯曲法

Community:

  • [ 1 ] [谢华]福州大学
  • [ 2 ] [陈文哲]福州大学
  • [ 3 ] [钱匡武]福州大学

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Source :

电镀与环保

ISSN: 1000-4742

CN: 31-1507/X

Year: 2004

Issue: 3

Volume: 24

Page: 13-15

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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