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author:

张钦钊 (张钦钊.) [1] | 李强 (李强.) [2] | 王爱香 (王爱香.) [3] | 刘紫兰 (刘紫兰.) [4] | 黄向东 (黄向东.) [5]

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CQVIP PKU CSCD

Abstract:

综述了铜-石墨滑动触头材料的研究进展,包括制备工艺、石墨含量、石墨粒度、添加组分和化学镀铜包覆石墨因素对铜石墨材料性能的影响以及铜石墨材料的摩擦学问题,最后指出了铜石墨自润滑触头材料的发展趋势.

Keyword:

制备工艺 动触头 包覆 化学镀铜 石墨材料 粒度 组分 自润滑 触头材料

Community:

  • [ 1 ] 福州大学材料科学与工程学院,福州,350002

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Source :

材料导报

ISSN: 1005-023X

Year: 2005

Issue: 2

Volume: 19

Page: 43-46

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count: -1

30 Days PV: 6

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