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author:

Liao, Juan (Liao, Juan.) [1] | Zhang, Nie (Zhang, Nie.) [2] | Chen, Yuxiang (Chen, Yuxiang.) [3] | Xue, Xin (Xue, Xin.) [4]

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EI

Abstract:

Herein, the ultrasonic vibration (UV) technology is introduced to assist the warm incremental forming of magnesium alloy AZ31B sheet. The corresponding experimental setups for UV-assisted warm tensile test and incremental forming are established. The effects of the forming temperature and UV on the forming force, formability, and geometry are analyzed. A fully thermal–mechanical coupling-based finite elemental model is established to simulate the forming process. The model takes into account the temperature distribution and the material behaviors affected by UV. The results indicate that the formability of the magnesium alloy can be significantly improved under conditions of UV at appropriate temperatures. The effect depends on the coupling effect of the temperature and the UV amplitude. The simulation and experimental results are compared. The merits of this new forming technology are further analyzed following simulation and experimental conditions. © 2022, The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature.

Keyword:

Aluminum sheet Finite element method Magnesium alloys Magnesium printing plates Tensile testing Ultrasonic effects Ultrasonic waves

Community:

  • [ 1 ] [Liao, Juan]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350116, China
  • [ 2 ] [Zhang, Nie]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350116, China
  • [ 3 ] [Chen, Yuxiang]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350116, China
  • [ 4 ] [Xue, Xin]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350116, China

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Source :

International Journal of Advanced Manufacturing Technology

ISSN: 0268-3768

Year: 2022

Issue: 7-8

Volume: 119

Page: 4559-4571

3 . 4

JCR@2022

2 . 9 0 0

JCR@2023

ESI HC Threshold:66

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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