Pressure　oxidation　leaching　behavior　of　chalcopyrite　in　sulfuric　acid　solution　from　110　°C　to　150　°C　were　investigated　by　in-situ　electrochemical　methods.　Leaching　experiments　under　saturated　vapor　pressure　conditions　were　used　to　simulate　the　anoxic　environment　that　may　be　encountered　in　industrial　applications.　Scanning　electron　microscope　and　X-ray　photoelectron　spectroscopy　were　used　to　characterize　the　morphology　and　the　chemical　status　of　chalcopyrite　surface.　Results　show　that　the　copper　extraction　was　increased　with　the　increase　of　leaching　temperature.　Under　the　optimal　leaching　conditions　under　saturated　vapor　pressure,　the　copper　and　iron　extraction　are　8.3%　and　29.8%,　respectively.　When　the　temperature　increased　from　110　°C　to　150　°C,　the　self-corrosion　potential　and　electrochemical　reaction　resistance　firstly　increased　and　then　decreased.　In　contrast,　the　resistance　of　the　passive　film　was　always　increased　with　the　increase　of　temperature.　The　electrochemical　study　results　indicated　that　the　increase　in　temperature　affected　the　oxidation　of　chalcopyrite　by　altering　the　kinetics　of　the　cathodic　reaction　and　the　anodic　passivation.　Both　the　self-corrosion　current　density　(icorr)　and　rate　constant　were　affected　by　the　reduction　of　Fe(III).　The　XPS　results　show　that　elemental　sulfur　and　H3O(Fe3(SO4)2(OH)6)　were　the　main　leaching　solid　products.　The　formation　of　H3O(Fe3(SO4)2(OH)6)　not　only　caused　a　decrease　in　cathodic　reaction　kinetics,　but　also　increased　the　resistance　of　mass　transfer　process.　Due　to　the　faster　release　of　iron,　copper-rich　sulphides　were　formed,　which　mixed　with　the　elemental　sulfur　and/or　H3O(Fe3(SO4)2(OH)6)　led　to　coverage　of　the　chalcopyrite　surface.　©　2022　The　Authors