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author:

Liu, M. (Liu, M..) [1] | Yan, F. (Yan, F..) [2]

Indexed by:

Scopus

Abstract:

Microscratch test was conducted on four different diamond-like carbon (DLC) films by Vickers indenter to study the scratch resistance of films under progressive normal load linearly increasing from 5 mN to 15 N. With the increase of normal load, penetration depth, lateral force, residual and contact scratch widths increase nonlinearly; scratch hardness and lateral hardness decrease nonlinearly; scratch friction coefficient increases under small loads, and then tends to be a constant under large loads. DLC-H has the smallest scratch friction coefficient among the four films, and different targets have little effect on scratch friction coefficient. DLC-Si and DLC-Cr have almost the same scratch resistance (or penetration depth), and larger than that of DLC, whose scratch resistance is almost the same as that of DLC-H. Fracture toughness was obtained by scratch-based methodologies: the additional Si or Cr target can enhance fracture properties of DLC film-steel substrate systems, whereas C4H10 can harm fracture properties. Fracture toughness of DLC-Si (about 17 MPa·m1/2) was larger than that of DLC-Cr (about 15 MPa·m1/2) with the large values of fracture toughness obtained under penetration depth larger than film thickness attributed to substrate effect. © 2022

Keyword:

Diamond-like carbon; Fracture toughness; Progressive normal load; Scratch resistance; Thin films; Vickers indenter

Community:

  • [ 1 ] [Liu, M.]Fujian Provincial Key Laboratory of Terahertz Functional Devices and Intelligent Sensing, School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350108, China
  • [ 2 ] [Yan, F.]Fujian Provincial Key Laboratory of Terahertz Functional Devices and Intelligent Sensing, School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350108, China

Reprint 's Address:

  • [Liu, M.]School of Mechanical Engineering and Automation, Qishan Campus, No. 2 Xueyuan Road University Town, China

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Source :

Thin Solid Films

ISSN: 0040-6090

Year: 2022

Volume: 756

2 . 1

JCR@2022

2 . 0 0 0

JCR@2023

ESI HC Threshold:91

JCR Journal Grade:3

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 10

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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