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Abstract:
Entangled metallic wire material-silicone rubber (EMWM-SR) composites with a three-dimensional interpenetrating network structure were manufactured through the vacuum infiltration method with the matrix of entangled metallic wire material (EMWM) and reinforcing element of silicone rubber (SR). Quasistatic compression tests and low-velocity impact tests of the proposed composites were performed, and the deformation model and damage characteristics of the tested EMWM-SR composites were investigated by per-forming computerized tomography scans and indentation depths. Experimental results show that the stiffness and energy consumption of the EMWM-SR composites are more than twice the sum of those of the individual EMWM and SR in the displacement range of 1.5-4.0 mm. With the increase of loading displacement, the stiffness of EMWM-SR com-posites increases steadily and the energy consumption increases sharply. Compared with EMWM and SR, the maximum displacement and peak force of the composite materials are decreasing significantly in the low-velocity impact tests. With increasing density, the impact resistance of the composites increases, while the energy absorption decreases. In other words, EMWM-SR 2.6 has better impact resistance but lower energy absorption ca-pacity. The maximum displacement and the peak force increase synchronously with the increase in impact velocity. Interestingly, the composites maintain a high energy absorp-tion capacity at different impact speeds. Furthermore, the energy absorption characteris-tics of the EMWM-SR composites under low-velocity impact are described in terms of the deformation mechanism of the wires.(c) 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
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JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
ISSN: 2238-7854
Year: 2023
Volume: 23
Page: 3856-3868
6 . 2
JCR@2023
6 . 2 0 0
JCR@2023
ESI Discipline: MATERIALS SCIENCE;
ESI HC Threshold:49
JCR Journal Grade:1
CAS Journal Grade:1
Cited Count:
SCOPUS Cited Count: 10
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 0
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