Ethylene-vinyl　acetate　copolymer　(EVA)　has　been　widely　used　for　packaging　materials　for　decades.　However,　EVA　was　highly　restricted　due　to　the　poor　thermal　stability　and　anti-static　performance.　For　enhancing　thermal　stability　and　anti-static　performances,　a　large　number　of　additives　were　added　to　EVA,　which　seriously　prejudice　the　processability　and　mechanical　properties　of　the　polymer.　To　address　this　problem,　N-doped　reduced　graphene　oxide@Fe2O3　(RGF)　was　constructed　as　a　heat　and　electronic　conduction　actor　in　EVA　matrix　in　this　work.　As　as-prepared　RGF　composites　shown,　Fe2O3　particles　well　dispersed　on　the　surface　of　RGO　sheets,　forming　a　point-plane　three-dimensional　structure.　Therefore,　the　thermal　conductivity　and　volume　resistivity　of　the　EVA　composites　reached　0.58　W/mK　and　1.7　x　10(10)　ohm　center　dot　cm　at　1.0　wt.%　of　RGF　addition,　which　shows　284%　folds　increasement　and　7　orders　of　magnitude　decrement　than　neat　EVA.　Moreover,　the　storage　modulus　and　thermal　stability　of　EVA　composites　at　180　degrees　C　were　also　improved.　In　sum,　all　those　enhancements　were　attributed　to　the　Fe2O3　particles　well　dispersed　on　RGO　sheets,　and　amino　groups　from　RGF　provided　mass　of　hydrogen　bonds　with　EVA　chains　which　provide　more　sites　and　path　for　heat　and　electronic　conduction.　In　this　work,　RGF　composites　and　its　synthesis　strategy　show　potential　promising　in　the　highly　effective　thermal　and　electrical　exchange　materials.