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author:

Bingbing Shi (Bingbing Shi.) [1] | Du Hong (Du Hong.) [2] | Wenweijiao Wang (Wenweijiao Wang.) [3] | Longshui Su (Longshui Su.) [4] | Chen Wang (Chen Wang.) [5] | Lei Xiao (Lei Xiao.) [6] | Tianyu Ma (Tianyu Ma.) [7] | Jianhui Zhou (Jianhui Zhou.) [8]

Abstract:

The Cu–1.1 wt% Hf–0.1 wt% Si alloy containing various precipitates is studied as a novel precipitation‐strengthened alloy with high strength and high electrical conductivity. The Cu–Hf–Si alloy prepared by solution, cold rolling, and aging processes exhibits a hardness of 238.92 HV, a tensile strength of 691.01 MPa, a breaking elongation of 15.09%, and an electrical conductivity of 62.34% International Annealed Copper Standard. The optimal peak aging parameter for Cu–Hf–Si alloy is 430 °C for 90 min. The precipitation of Hf and Si atoms from the Cu matrix is helpful to enhance the electrical conductivity. The precipitation of Hf can produce fibrous Guinier Preston zone and γ' precipitate, as well as spherical Cu10Hf7 phases. In addition, the coprecipitation of Si and Hf can also produce Hf3(Cu2Si)2 and HfCuSi phases. The high strength of Cu–Hf–Si alloy is mainly due to the multiprecipitates synergistic strengthening.

Keyword:

aging Cu—Hf—Si alloys electrical conductivity mechanical properties precipitates

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Source :

Advanced Engineering Materials

ISSN: 1438-1656

Year: 2023

Issue: 21

Volume: 25

Page: n/a-n/a

3 . 4

JCR@2023

3 . 4 0 0

JCR@2023

JCR Journal Grade:2

CAS Journal Grade:4

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SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

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30 Days PV: 0

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