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author:

Liao, J. (Liao, J..) [1] (Scholars:薛新) | Peng, F. (Peng, F..) [2] | Xue, X. (Xue, X..) [3] (Scholars:薛新)

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Abstract:

Steel-aluminum laminates show promise in industrial manufacturing, yet their utilization is limited by unstable interface bonding. This study investigates the influence of laser texturing on the interface bonding properties of DP600/AA1060 obtained through co-extrusion. White-light interference profilometry (WLIP) and MATLAB algorithms are used to quantify different surfaces. A model is established to predict the shear load with different process angles. Furthermore, energy dispersive spectroscopy (EDS), scanning electron microscope (SEM) and X-ray diffraction (XRD) are utilized to examine the microstructure of interface fractures and DP600/AA1060 alloys. Notably, the laser texturing process (LTP) significantly enhances the interface bonding strength of the DP600/AA1060, yielding a 37% increase in maximum shear strength compared to the original sample. The prediction holds true for the process angle in the range of 0°–45° but failed between 45° and 90° due to the occurrence of tensile/compressive stress in the laser-textured area, leading to unstable bonding caused by oxides and alloy particles. However, the laser-textured surface of DP600 enhances mechanical interlocking and increases the number of micro-protrusions, thereby strengthening the interface bonding and improving the mechanical properties of co-extruded laminates. © 2024 The Authors

Keyword:

Co-extruded laminate Dissimilar DP600/AA1060 alloys Interface bonding property Laser texturing

Community:

  • [ 1 ] [Liao J.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China
  • [ 2 ] [Peng F.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China
  • [ 3 ] [Xue X.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China

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Source :

Journal of Materials Research and Technology

ISSN: 2238-7854

Year: 2024

Volume: 31

Page: 543-554

6 . 2 0 0

JCR@2023

CAS Journal Grade:2

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WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

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30 Days PV: 0

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