Enhancing　critical　heat　flux　(CHF)　and　heat　transfer　coefficient　(HTC)　by　promoting　the　nucleation,　growth,　and　departure　of　boiling　bubbles　has　drawn　significant　attention　owing　to　its　wide　applications.　However,　in-depth　understanding　and　comprehensive　manipulation　of　under-liquid　bubble　dynamics　from　in　situ　microscale　perspectives　remain　challenging.　Herein,　in　situ　observations　and　analyses　of　the　microsized　boiling　bubbles　of　ultra-low　surface　tension　fluorinated　liquids　(FLs)　are　conducted　on　the　superaerophobic　silicon　surfaces　with　crisscross　microchannels　and　selective　nanowires.　It　is　revealed　that　deep　microchannels　yet　short　nanowires　enable　ultrafast　liquid　spreading　(＜549.6　ms)　and　ultralow　bubble　adhesion　(approximate　to　1.1　N),　while　an　appropriate　spacing　(240-600　mu　m)　between　microchannels　minimizes　the　bubble　departure　time　(＜20.6　ms)　due　to　timely　coalescence.　By　verifying　the　above　bubble　dynamics　principles　through　the　collaborative　enhancement　of　CHF　and　HTC,　an　optimized　structure　(microchannel　depth　approximate　to　52.9　m,　microchannel　spacing　approximate　to　362.9　mu　m,　nanowire　length　approximate　to　0　nm)　is　obtained　and　further　implemented　onto　the　exposed　Si　surface　of　a　commercial　CPU　chip.　Cooled　by　phase-change　of　FLs,　the　average　temperature　of　CPU　maintains　approximate　to　64.9　degrees　C　even　under　extreme　power　loads　(approximate　to　130　W),　far　below　than　those　in　conventional　air-cooling　and　water-cooling　operations.