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author:

Zhao, Z. (Zhao, Z..) [1] | Gan, K.-J. (Gan, K.-J..) [2] | Pan, S. (Pan, S..) [3] | Wang, S. (Wang, S..) [4] | Li, T. (Li, T..) [5] | Ruan, D.-B. (Ruan, D.-B..) [6]

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Abstract:

This work demonstrates a low thermal budget amorphous InWO (α-IWO) thin film transistor (TFT) achieving a subthreshold swing (S.S.) of 40 mV/decade without utilizing a ferroelectric gate oxide. The oxygen vacancies in α-IWO induce the formation of an interfacial dipole layer at the surface between α-IWO and SiO2/HfO2. The TFT with dipole-rich interface exhibits the S.S. value below 60 mV/decade over 2 decades of drain current. X-ray diffraction (XRD) confirmed the absence of the ferroelectric orthorhombic phase in the HfO2 layer. Besides, the low thermal budget α-IWO TFT also exhibits a high field effect mobility of 97 cm2/V.s and a large on/off current ratio of 1.8E6, while the process temperature is as low as 300 °C. © 1980-2012 IEEE.

Keyword:

High-k Engineering α-InWO Interfacial Dipole Layer Negative Capacitance-Like Oxygen Vacancy Steep Subthreshold Swing Thin Film Transistor

Community:

  • [ 1 ] [Zhao Z.]Fuzhou University, FZU-Jinjiang Joint Institute of Microelectronics, College of Physics and Information Engineering, School of Advanced Manufacturing, Fuzhou University, 350001, China
  • [ 2 ] [Gan K.-J.]Fuzhou University, FZU-Jinjiang Joint Institute of Microelectronics, College of Physics and Information Engineering, School of Advanced Manufacturing, Fuzhou University, 350001, China
  • [ 3 ] [Pan S.]Fuzhou University, FZU-Jinjiang Joint Institute of Microelectronics, College of Physics and Information Engineering, School of Advanced Manufacturing, Fuzhou University, 350001, China
  • [ 4 ] [Wang S.]Fuzhou University, FZU-Jinjiang Joint Institute of Microelectronics, College of Physics and Information Engineering, School of Advanced Manufacturing, Fuzhou University, 350001, China
  • [ 5 ] [Li T.]Fuzhou University, FZU-Jinjiang Joint Institute of Microelectronics, College of Physics and Information Engineering, School of Advanced Manufacturing, Fuzhou University, 350001, China
  • [ 6 ] [Ruan D.-B.]Fuzhou University, FZU-Jinjiang Joint Institute of Microelectronics, College of Physics and Information Engineering, School of Advanced Manufacturing, Fuzhou University, 350001, China

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Source :

IEEE Electron Device Letters

ISSN: 0741-3106

Year: 2025

Issue: 3

Volume: 46

Page: 436-439

4 . 1 0 0

JCR@2023

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ESI Highly Cited Papers on the List: 0 Unfold All

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30 Days PV: 0

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