Electroplating　gold　coating　is　very　important　for　both　jewelry　industry　and　fabrication　of　functional　materials.　The　traditional　process　for　gold　plating　is　fulfilled　in　the　cyanide-containing　solution,　which　can　potentially　produce　hazardous　HCN　gas　during　electrodeposition　and　generate　hazardous　CN--containing　wastewater.　In　addition,　the　residual　CN-　ions　in　substrate　can　damage　the　post-coated　microelectronics.　Cyanide-free　processes　for　electroplating　gold　are　springing　up　these　years,　showing　great　potential　for　replacing　the　environmentally　unfriendly　cyanide　process.　In　this　review,　the　types　of　gold　coatings　are　first　summarized.　Then　the　physicochemical　properties　of　various　cyanide-free　complexing　agents　for　electroplating　gold　film　are　compared.　Subsequently,　cyanide-free　systems　that　have　great　potential　for　industrialization　are　introduced,　with　other　novel　cyanide-free　systems　still　on　its　infant　being　also　suggested.　Finally,　the　existing　problems　and　future　developments　are　anticipated.　The　contents　can　hopefully　provide　comprehensive　understanding　of　the　cyanide-free　gold　electroplating　process.