Micro　Light　Emitting　Diode　(Micro-LED)　technology,　characterized　by　exceptional　brightness,　low　power　consumption,　fast　response,　and　long　lifespan,　holds　significant　potential　for　next-generation　displays,　yet　its　commercialization　hinges　on　resolving　challenges　in　high-density　interconnect　fabrication,　particularly　micrometer-scale　bump　formation.　Traditional　fabrication　approaches　such　as　evaporation　enable　precise　bump　control　but　face　scalability　and　cost　limitations,　while　electroplating　offers　lower　costs　and　higher　throughput　but　suffers　from　substrate　conductivity　requirements　and　uneven　current　density　distributions　that　compromise　bump-height　uniformity.　Emerging　alternatives　include　electroless　plating,　which　achieves　uniform　metal　deposition　on　non-conductive　substrates　through　autocatalytic　reactions　albeit　with　slower　deposition　rates;　ball　mounting　and　dip　soldering,　which　streamline　processes　via　automated　solder　jetting　or　alloy　immersion　but　struggle　with　bump　miniaturization　and　low　yield;　and　photosensitive　conductive　polymers　that　simplify　fabrication　via　photolithography-patterned　composites　but　lack　validated　long-term　stability.　Persistent　challenges　in　achieving　micrometer-scale　uniformity,　thermomechanical　stability,　and　environmental　compatibility　underscore　the　need　for　integrated　hybrid　processes,　eco-friendly　manufacturing　protocols,　and　novel　material　innovations　to　enable　ultra-high-resolution　and　flexible　Micro-LED　implementations.　This　review　systematically　compares　conventional　and　emerging　methodologies,　identifies　critical　technological　bottlenecks,　and　proposes　strategic　guidelines　for　industrial-scale　production　of　high-density　Micro-LED　displays.