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学者姓名：黄煜华
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Abstract ：
High-precision eddy current sensors for displacement and thickness measurement play a crucial role in vital fields such as semiconductor manufacturing, precision optics, and aerospace. As precision manufacturing advances towards digitalization and intelligence, the performance and functionality of these sensors face increasingly stringent demands. In this review, the analytical and equivalent circuit model of eddy current detection are analyzed from the basic structure and working principle, obtaining the application branch of displacement and thickness measurement. The optimization of configuration, signal processing circuitry, and temperature compensation technology is reviewed for the improvement of core performance indicators such as range, resolution, and thermal stability. The challenges faced in practical applications, including the suppression of lift-off effect, multilayer film thickness measurement and edge detection, are identified. Finally, the development direction of eddy current displacement and thickness sensors is envisioned.
Keyword ：
Displacement measurement Displacement measurement Eddy current sensors Eddy current sensors Lift-off effect Lift-off effect Resolution Resolution Thickness measurement Thickness measurement
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| GB/T 7714 | Zhao, Guangen , Huang, Yuhua , Zhang, Wenwei et al. Advances in high-precision displacement and thickness measurement based on eddy current sensors: A review [J]. | MEASUREMENT , 2025 , 243 . |
| MLA | Zhao, Guangen et al. "Advances in high-precision displacement and thickness measurement based on eddy current sensors: A review" . | MEASUREMENT 243 (2025) . |
| APA | Zhao, Guangen , Huang, Yuhua , Zhang, Wenwei , Wang, Chengxin , Chen, Jianxiong . Advances in high-precision displacement and thickness measurement based on eddy current sensors: A review . | MEASUREMENT , 2025 , 243 . |
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Due to its exceptional mechanical and chemical properties at high temperatures, Inconel 718 is extensively utilized in industries such as aerospace, aviation, and marine. Investigating the flow behavior of Inconel 718 under high strain rates and high temperatures is vital for comprehending the dynamic characteristics of the material in manufacturing processes. This paper introduces a physics-based constitutive model that accounts for dislocation motion and its density evolution, capable of simulating the plastic behavior of Inconel 718 during large strain deformations caused by machining processes. Utilizing a microstructure-based flow stress model, the machinability of Inconel 718 in terms of cutting forces and temperatures is quantitatively predicted and compared with results from orthogonal cutting experiments. The model's predictive precision, with a margin of error between 5 and 8%, ensures reliable consistency and enhances our comprehension of the high-speed machining dynamics of Inconel 718 components.
Keyword ：
flow stress model flow stress model Inconel 718 Inconel 718 machinability machinability microstructure microstructure
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| GB/T 7714 | Yin, Qingan , Chen, Hui , Chen, Jianxiong et al. Microstructure-Based Flow Stress Model to Predict Machinability of Inconel 718 [J]. | MATERIALS , 2024 , 17 (17) . |
| MLA | Yin, Qingan et al. "Microstructure-Based Flow Stress Model to Predict Machinability of Inconel 718" . | MATERIALS 17 . 17 (2024) . |
| APA | Yin, Qingan , Chen, Hui , Chen, Jianxiong , Xie, Yu , Shen, Ming , Huang, Yuhua . Microstructure-Based Flow Stress Model to Predict Machinability of Inconel 718 . | MATERIALS , 2024 , 17 (17) . |
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Silicon carbide (SiC) is extremely hard and brittle, posing challenges for traditional abrasive machining. This study used molecular dynamics simulations to investigate synchronous versus asynchronous force -torque effects on SiC abrasive machining. Multi-grit diamond abrasion of 4H-SiC was modeled by applying controlled sinusoidal forces and torques. Asynchronous force -torque increased material removal rates up to 2X versus synchronous conditions by promoting particle agglomeration and enabling trapped particles to contribute. However, asynchronous operation also produced higher surface roughness and subsurface cracking from greater penetration. The alternating forces generated larger stresses that may have driven more plastic deformation and brittle fracture. The study provided atomic-scale insights into force -torque effects, establishing guidelines to potentially enhance efficiency through asynchronous operation despite drawbacks.
Keyword ：
Abrasive machining Abrasive machining Force -torque synchronization Force -torque synchronization Molecular dynamics Molecular dynamics Silicon carbide Silicon carbide
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| GB/T 7714 | Chen, Hui , Wang, Chengxin , Chen, Jianxiong et al. Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining [J]. | TRIBOLOGY INTERNATIONAL , 2024 , 192 . |
| MLA | Chen, Hui et al. "Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining" . | TRIBOLOGY INTERNATIONAL 192 (2024) . |
| APA | Chen, Hui , Wang, Chengxin , Chen, Jianxiong , Xie, Yu , Sun, Kailin , Huang, Yuhua et al. Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining . | TRIBOLOGY INTERNATIONAL , 2024 , 192 . |
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Ta barrier layers are commonly used in microelectronic devices to prevent direct Cu-Si contact. To better understand the deposition mechanism of Cu seed layers on Ta barriers, which is crucial for improving film quality, we conducted molecular dynamics simulations to analyze this process at the atomic level. The investigation focused on analyzing the effects of deposition temperature and incident energy on film surface roughness, interface mixing and dislocation defects, systematically elucidated the underlying mechanisms. Simulation results indicate that only a minor amount of interface mixing occurs when the deposition energy approaches 40 eV, confirming the effectiveness as a barrier material. At lower deposition energies, increasing the energy significantly reduces the surface roughness of the Cu seed layer, but beyond 5 eV, it stabilizes around 0.9 & Aring;. Dislocation density continuously decreases substantially with increasing energy. The deposition temperature is positively correlated with the surface roughness, while dislocation defects fluctuate with temperature, peaking near 400 K and reaching minimal values near 600 K. With further increases in temperature, the dislocation density begins to rise slowly. Consequently, this work conducted a comprehensive analysis of the deposition mechanism, which has significant implications for practical deposition processes of Cu seed layers in semiconductor devices, offering novel insights for the microscopic analysis of deposition parameters applicable to thin film deposition in other contexts.
Keyword ：
Diffusion process Diffusion process Molecular dynamics Molecular dynamics Surface quality Surface quality
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| GB/T 7714 | Zhao, Bo , Li, Rui , Huang, Yuhua et al. Investigation of the deposition mechanism of Cu seed layer atoms on the Ta (001) surface from the atomic perspective [J]. | APPLIED SURFACE SCIENCE , 2024 , 685 . |
| MLA | Zhao, Bo et al. "Investigation of the deposition mechanism of Cu seed layer atoms on the Ta (001) surface from the atomic perspective" . | APPLIED SURFACE SCIENCE 685 (2024) . |
| APA | Zhao, Bo , Li, Rui , Huang, Yuhua , Xi, Yang , Tian, Zhiqiang , Wang, Shizhao et al. Investigation of the deposition mechanism of Cu seed layer atoms on the Ta (001) surface from the atomic perspective . | APPLIED SURFACE SCIENCE , 2024 , 685 . |
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The advent of 3-D NAND architecture has introduced new integration challenges, particularly regarding the impact of thermal-mechanical stress during manufacturing, which significantly affects device performance. This study establishes a 3-D NAND flash memory process mechanics model using a local representative volume element (RVE) finite element modeling framework. We thoroughly analyze the causes of warpage during the 3-D NAND manufacturing process and monitor the evolution of mechanical stress and related structural deformations. Additionally, we examine the deformation distribution under sequential processes and investigate how different process conditions impact asymmetric deformation. Our findings have potential significance for improving device structure reliability and optimizing process parameters in 3-D NAND memory manufacturing. By providing insights into stress evolution and deformation mechanisms, this work contributes to addressing the challenges associated with increasing storage density in 3-D NAND technology.
Keyword ：
3-D NAND 3-D NAND Analytical models Analytical models Deformation Deformation Etching Etching Finite element analysis Finite element analysis Material properties Material properties Metals Metals process mechanics model process mechanics model representative volume element (RVE) representative volume element (RVE) Semiconductor device modeling Semiconductor device modeling Solid modeling Solid modeling Stress Stress Three-dimensional displays Three-dimensional displays
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| GB/T 7714 | Tian, Zhiqiang , Zhang, Gang , Huang, Yuhua et al. Process Mechanics Model and Asymmetric Residual Stress Analysis During 3-D NAND Manufacturing [J]. | IEEE TRANSACTIONS ON ELECTRON DEVICES , 2024 , 72 (1) : 193-198 . |
| MLA | Tian, Zhiqiang et al. "Process Mechanics Model and Asymmetric Residual Stress Analysis During 3-D NAND Manufacturing" . | IEEE TRANSACTIONS ON ELECTRON DEVICES 72 . 1 (2024) : 193-198 . |
| APA | Tian, Zhiqiang , Zhang, Gang , Huang, Yuhua , Wang, Shizhao , Liu, Sheng . Process Mechanics Model and Asymmetric Residual Stress Analysis During 3-D NAND Manufacturing . | IEEE TRANSACTIONS ON ELECTRON DEVICES , 2024 , 72 (1) , 193-198 . |
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Axial Flux Permanent Magnet Motors (AFPMM), known for their high power density, energy efficiency, and compact design, hold great potential for widespread use in electric vehicle applications. Despite these advantages, AFPMMs face challenges such as demagnetization of permanent magnets and magnetic insulation layer failure under high-temperature conditions. To mitigate these thermal challenges, this paper introduces a novel cooling structure that incorporates a corrugated spiral flow channel, utilizing nanofluids for enhanced thermal conductivity. The performance of this structure is evaluated and compared with that of the conventional linear spiral flow channel using numerical analysis. An analysis of the structural parameters' influence on fluid flow within the corrugated spiral flow channel is conducted, and a Support Vector Machine (SVM) model along with a Nondominated Sorting Genetic Algorithm II (NSGA-II) are employed to optimize these parameters for the cooling channel. The results demonstrate that the new channel exhibits superior heat transfer performance. Under identical conditions, the implementation of the corrugated spiral flow channel maintained the highest temperature at the windings of the AFPMM at 81.49 degrees C, which is a reduction of 1.67 degrees C compared to the conventional linear spiral flow channel.
Keyword ：
Axial flux permanent magnet motor Axial flux permanent magnet motor Cooling structure Cooling structure Corrugated spiral channel Corrugated spiral channel Enhanced heat transfer Enhanced heat transfer
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| GB/T 7714 | Chen, Hui , Xiao, Junyang , Huang, Yuhua et al. Cooling Enhancement of Axial Flux Permanent Magnet Motors by Corrugated Spiral Channels with Nanofluid [J]. | JOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY , 2024 , 20 (3) : 1523-1540 . |
| MLA | Chen, Hui et al. "Cooling Enhancement of Axial Flux Permanent Magnet Motors by Corrugated Spiral Channels with Nanofluid" . | JOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY 20 . 3 (2024) : 1523-1540 . |
| APA | Chen, Hui , Xiao, Junyang , Huang, Yuhua , He, Panfeng , Zhang, Jianfeng . Cooling Enhancement of Axial Flux Permanent Magnet Motors by Corrugated Spiral Channels with Nanofluid . | JOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY , 2024 , 20 (3) , 1523-1540 . |
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