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学者姓名：李亚强
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Abstract ：
As one of the most promising non-noble metal catalysts for the oxygen reduction reaction (ORR), the atomically dispersed iron, nitrogen co-coordinated carbon (Fe-N-C) catalyst featuring Fe-Nx sites has gained widespread application in fuel cells and Zn-air batteries due to its highest atomic utilization, tunable electronic structure and excellent catalytic activity. In this review, we provide a comprehensive summary and discussion of recent advancements in atomically dispersed Fe-N-C catalysts. Initially, the design principles and preparation methods for efficient Fe-N-C are introduced in detail, focusing on three key aspects: enhancing active site loading, improving intrinsic activity and constructing hierarchical porous structures. Additionally, this review systematically summarizes the application of various advanced characterization techniques in the structural analysis of active sites. Finally, we outline the existing challenges and research directions of atomically dispersed Fe-N-C, offering new insights and guidance for the future development of high-performance oxygen reduction catalysts.
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| GB/T 7714 | Xu, Hao , Li, Ruopeng , Li, Yaqiang et al. Research progress of atomically dispersed iron, nitrogen co-coordinated carbon catalysts for oxygen reduction: a mini-review [J]. | JOURNAL OF MATERIALS CHEMISTRY A , 2025 , 13 (19) : 13675-13692 . |
| MLA | Xu, Hao et al. "Research progress of atomically dispersed iron, nitrogen co-coordinated carbon catalysts for oxygen reduction: a mini-review" . | JOURNAL OF MATERIALS CHEMISTRY A 13 . 19 (2025) : 13675-13692 . |
| APA | Xu, Hao , Li, Ruopeng , Li, Yaqiang , Lu, Xiangyu , Liu, Huan , Yang, Peixia et al. Research progress of atomically dispersed iron, nitrogen co-coordinated carbon catalysts for oxygen reduction: a mini-review . | JOURNAL OF MATERIALS CHEMISTRY A , 2025 , 13 (19) , 13675-13692 . |
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铜柱互连因具有细间距、高导电性、高可靠性的优点,成为传统焊点的替代品.然而,铜柱生长过程容易形成光滑度很差的凹凸表面,严重影响铜柱的可靠性.本文采用有限元方法研究了加速剂聚二硫二丙烷磺酸钠(SPS)对铜柱生长的影响.基于电化学测试、分子动力学模拟以及有限元拟合方法,建立了基于物质传质、添加剂吸附、电极表面电化学还原以及铜柱生长的有限元仿真模型.在无添加剂的条件下,铜柱的生长可分为均匀生长阶段和凹形生长阶段,最终会形成凹形的铜柱顶面.引入SPS后,在生长过程中,SPS会在底角处积累,铜柱的生长呈现"V"形生长的特点.随着"V"形生长的进行,由于铜柱的轮廓拓扑变化,会在中间部位形成新的底角,SPS在中间区域的积累会加速铜的沉积.因而通过调控SPS的浓度,可以调控铜柱的生长过程,得到高均匀性的铜柱.
Keyword ：
分子动力学模拟 分子动力学模拟 均匀性 均匀性 有限元模拟 有限元模拟 铜柱生长 铜柱生长
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| GB/T 7714 | 彭雪嵩 , 江杰 , 李铭杰 et al. 基于有限元方法分析加速剂SPS对铜柱凸点互连均匀性的影响 [J]. | 电镀与精饰 , 2025 , 47 (3) : 10-17 . |
| MLA | 彭雪嵩 et al. "基于有限元方法分析加速剂SPS对铜柱凸点互连均匀性的影响" . | 电镀与精饰 47 . 3 (2025) : 10-17 . |
| APA | 彭雪嵩 , 江杰 , 李铭杰 , 王福学 , 罗秀彬 , 杨培霞 et al. 基于有限元方法分析加速剂SPS对铜柱凸点互连均匀性的影响 . | 电镀与精饰 , 2025 , 47 (3) , 10-17 . |
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The work aims to systematically improve the roughening performance of electrolytic copper foil with a composite additive of sodium molybdate, sodium tungstate, and hydroxyethyl cellulose (HEC). Electrolytic copper foil is widely used in electronic devices, especially printed circuit boards (PCBs), with key performance requirements including high peel strength and low surface roughness. In order to optimize these properties, direct current electroplating was used in a copper sulfate electroplating system and various characterization techniques were employed such as scanning electron microscopy (SEM), laser confocal microscopy (LCM), and peel strength testing. The microstructure of the rough copper foil was analyzed in detail, and the impact of various additives on the roughening effect was analyzed through orthogonal experiments and range analysis. The addition of sodium molybdate and HEC alone significantly refined the grain structure of the copper foil surface, improving its smoothness and uniformity. In contrast, sodium tungstate mainly improved the peel strength and had a relatively small impact on grain refinement. The composite additive showed significant synergistic effects, effectively optimizing the microstructure of copper foil under different concentration combinations. Specifically, the concentrations of 40 mg/L sodium molybdate, 30 mg/L sodium tungstate, and 8 mg/L HEC produced the best roughening results, with the lowest surface roughness (Rz=1.24 µm) and relatively high peel strength (0.94 N/mm). LCM measurements indicated that optimized composite additives significantly reduced surface roughness, helping to minimize signal transmission losses and improve the overall performance and reliability of PCBs. In addition, the importance of the three additives on Q was in the following order: sodium molybdate>sodium tungstate>HEC, and the Q value reached its maximum value (0.76) under optimal conditions. Through a comprehensive analysis of the additive mechanism, the optimal composite additive formulation was identified, significantly improving the roughening performance of copper foil. This method not only enhanced peel strength and surface roughness but also promoted grain refinement, making the copper foil perform exceptionally in high-performance electronic applications. The synergistic effect of the composite additive optimized the microstructure of the copper foil, further improving its overall mechanical properties and adhesion characteristics. The study results demonstrated that the composite additive achieved good effects under different concentration conditions, providing technical support for producing low-profile copper foil suitable for high-performance electronic devices. By systematically optimizing the concentrations of sodium molybdate, sodium tungstate, and HEC composite additives, this study significantly improves the surface and mechanical properties of ultra-thin electrolytic copper foil, proposing innovative research findings. This research provides new directions for the preparation of low-profile electrolytic copper foil, with significant theoretical and practical value. By reducing surface roughness while maintaining high peel strength, this study lays a solid technical foundation for the miniaturization, high performance, and long-term reliability of future electronic devices, further advancing copper foil technology in the electronics industry. © 2025 Chongqing Wujiu Periodicals Press. All rights reserved.
Keyword ：
Copper refining Copper refining Surface roughness Surface roughness
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| GB/T 7714 | Peng, Xuesong , Gui, Haoliang , Jiang, Jie et al. Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil [J]. | Surface Technology , 2025 , 54 (8) : 191-200 . |
| MLA | Peng, Xuesong et al. "Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil" . | Surface Technology 54 . 8 (2025) : 191-200 . |
| APA | Peng, Xuesong , Gui, Haoliang , Jiang, Jie , Li, Yaqiang , Wang, Zongtai , Li, Ruopeng et al. Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil . | Surface Technology , 2025 , 54 (8) , 191-200 . |
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Fabricating nanocrystalline bright copper coatings is crucial for protection and decoration. A novel brightener organic anion acid blue 1 (AB1) was used to obtain nanocrystalline bright copper coatings. The suppressing effect of AB1 was verified and analyzed by electrochemical tests. Further insights into the effect mechanism of AB1 were investigated through density functional theory (DFT) calculations, molecular dynamics (MD) simulations and in situ Raman spectra. The phenomena of adsorption of AB1 on copper surface discovered by MD simulation and in situ Raman spectra, coupled with coordination interaction between - SO3- of AB1 and free Cu2+, synergistically inhibit the growth of copper coatings, resulting that compact and flat copper plating coatings were formed. The electroplating condition and copper coating morphology were studied, respectively. Bright flat copper coatings can be obtained with 100 to 200 mg/L AB1 under 5 A/dm2. Besides, mass spectrum (MS) was used to evaluate the stability of AB1. The phase structure under the influence of AB1 concentration was studied using XRD. With the increase of AB1 concentration, the (111) surface is preferentially obtained. The average grain size of optimized copper coating, calculated according to Scherrer's formula, is about 11 nm, indicating the acquisition of nanocrystalline copper plating coating. Finally, copper coatings obtained are of good corrosion resistance owing to low roughness and small grain size.
Keyword ：
Acid blue 1 Acid blue 1 Brightener Brightener Copper electroplating Copper electroplating MD simulation MD simulation Quantum chemical calculation Quantum chemical calculation
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| GB/T 7714 | Li, Mingjie , Li, Xin , Li, Yaqiang et al. Investigation of novel brightener acid blue 1 on copper electroplating coating [J]. | IONICS , 2024 , 31 (1) : 1061-1075 . |
| MLA | Li, Mingjie et al. "Investigation of novel brightener acid blue 1 on copper electroplating coating" . | IONICS 31 . 1 (2024) : 1061-1075 . |
| APA | Li, Mingjie , Li, Xin , Li, Yaqiang , Peng, Xuesong , Jiang, Jie , Meng, Fan et al. Investigation of novel brightener acid blue 1 on copper electroplating coating . | IONICS , 2024 , 31 (1) , 1061-1075 . |
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Rational construction of platinum (Pt)-based single-atom catalysts (SACs) with high utilization of active sites holds promise to achieve superior electrocatalytic alkaline HER performance, which requires the assistance of functional supports. In this work, a novel catalytic configuration is reported, namely, Pt SACs anchored on the nickel-chromium oxides labeled as Pt SACs-NiCrO3/NF. The mechanism associated with the metal-support interaction (MSI) for synergy co-catalysis that empowers efficient HER on Pt SACs-NiCrO3/NF is clarified. Specifically, the modulated electron structure in Pt SACs-NiCrO3 manipulates the interface microenvironment, mediating a more free water state, which is beneficial to accelerate front water dissociation behavior on the oxide support. Besides, the homogeneously distributed Pt sites with the created near-acidic state ensure the subsequent fast proton-involved reaction. All these determine the comprehensively accelerating HER kinetics. Consequently, Pt SACs-NiCrO3/NF deliverers considerable HER performance, with overpotentials (eta 10/eta 100) of 23/122 mV, high mass activity of 382.77 mA mg-1Pt. When serving in an alkaline water-based anion exchange membrane electrolytic cell (AEMWE), Pt SACs-NiCrO3/NF also presents excellent performance (100 mA cm-2 at the cell voltage of 1.51 V and stable up to 100 h), confirming its good prospect.
Keyword ：
hydrogen evolution reaction hydrogen evolution reaction interfacial microenvironment interfacial microenvironment metal-support interaction metal-support interaction platinum single atom catalysts platinum single atom catalysts
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| GB/T 7714 | Meng, Fan , Zhu, Longhao , Li, Ruopeng et al. Engineering Metal-Support Interaction for Manipulate Microenvironment: Single-Atom Platinum Decorated on Nickel-Chromium Oxides Toward High-Performance Alkaline Hydrogen Evolution [J]. | ADVANCED FUNCTIONAL MATERIALS , 2024 , 35 (10) . |
| MLA | Meng, Fan et al. "Engineering Metal-Support Interaction for Manipulate Microenvironment: Single-Atom Platinum Decorated on Nickel-Chromium Oxides Toward High-Performance Alkaline Hydrogen Evolution" . | ADVANCED FUNCTIONAL MATERIALS 35 . 10 (2024) . |
| APA | Meng, Fan , Zhu, Longhao , Li, Ruopeng , Jiang, Jie , Li, Yaqiang , Wu, Youzheng et al. Engineering Metal-Support Interaction for Manipulate Microenvironment: Single-Atom Platinum Decorated on Nickel-Chromium Oxides Toward High-Performance Alkaline Hydrogen Evolution . | ADVANCED FUNCTIONAL MATERIALS , 2024 , 35 (10) . |
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