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author:

Zhu, Zhaoju (Zhu, Zhaoju.) [1] (Scholars:朱兆聚) | He, Bingwei (He, Bingwei.) [2] (Scholars:何炳蔚) | Chen, Jianxiong (Chen, Jianxiong.) [3] (Scholars:陈剑雄)

Indexed by:

EI Scopus SCIE

Abstract:

Minimum quantity lubrication (MQL) as a green technology is widely employed in metal removal manufacturing, which can achieve lower cutting temperature and higher machining efficiency environmentally. However, how to evaluate the tool temperature distribution in drilling process with MQL is still significantly lacking. For this purpose, a tool-foil thermocouple system was developed and the influence of cooling conditions and cutting variations on tool temperature has been experimentally analyzed during high-throughput drilling of aluminum alloy AA2024 in current study. Results indicate that the maximum temperature along cutting edge is observed near drill center due to heat accumulation. Using MQL can decrease the temperature difference between drill center and outer corner compared with dry and air cooling conditions. Temperature distribution profiles are more sensitive to feed rate than cutting speed. Increasing feed rate can result in a great increasing of average temperature. Chipping is only observed on the peripheral corner under MQL condition, while adhesion and built up edge (BUE) almost extend across the whole cutting edge under dry drilling due to the absence of lubrication and coolant.

Keyword:

Aluminum alloy Drilling Minimum quantity lubrication Temperature distribution

Community:

  • [ 1 ] [Zhu, Zhaoju]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou, Fujian, Peoples R China
  • [ 2 ] [He, Bingwei]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou, Fujian, Peoples R China
  • [ 3 ] [Chen, Jianxiong]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou, Fujian, Peoples R China

Reprint 's Address:

  • 朱兆聚

    [Zhu, Zhaoju]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou, Fujian, Peoples R China

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Source :

JOURNAL OF MANUFACTURING PROCESSES

ISSN: 1526-6125

Year: 2020

Volume: 56

Page: 757-765

5 . 0 1

JCR@2020

6 . 1 0 0

JCR@2023

ESI Discipline: ENGINEERING;

ESI HC Threshold:132

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 20

SCOPUS Cited Count: 22

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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