Indexed by:
Abstract:
Copper Sulphide thin films have been prepared on different substrates using electrodeposition technique. X-ray diffraction analysis showed that the prepared films possess polycrystalline in nature with cubic structure. Microstructural parameters such as crystallite size, strain and dislocation density are determined using X-ray diffraction data. Film composition and surface morphology have been analyzed using Scanning electron microscopy and Energy dispersive analysis by X-rays. Optical absorption analysis showed that the prepared films possess band gap value in the range between 2.2 and 2.4 eV for films obtained on different substrates.
Keyword:
Reprint 's Address:
Email:
Version:
Source :
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN: 0957-4522
Year: 2014
Issue: 12
Volume: 25
Page: 5338-5344
1 . 5 6 9
JCR@2014
2 . 8 0 0
JCR@2023
ESI Discipline: MATERIALS SCIENCE;
ESI HC Threshold:355
JCR Journal Grade:2
CAS Journal Grade:3
Cited Count:
WoS CC Cited Count: 28
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 0
Affiliated Colleges: