Silver　has　grown　its　attraction　of　the　scientists　in　microelectronic　field　recently.　Electrochemical　deposition　of　silver　onto　copper　substrates　by　immersion　method　has　been　one　of　the　keen　topics.　In　this　study,,　ethanol　was　used　as　the　plating　solution　in　which　some　chemicals　were　added.　The　silver　deposits　were　characterized　by　a　field　emission　scanning　electron　microscopy　(FESEM),　an　atom　force　microscope　(AFM),　a　transmission　electron　microscope　(TEM)　and　a　selected　area　electron　diffraction　(SAED).　It　was　found　that　silver　immersion　using　ethanol-based　bath　has　good　coverage　feature.　The　highlands　of　the　copper　substrate　are　coated　by　silver　particles.　whose　sizes　are　around　12　nm,　but　those　sizes　at　low-lying　lands　are　a　little　smaller.