This　research　proposes　an　optimization　approach　to　enhance　the　stencil　printing　process　(SPP)　in　surface　mount　printed　circuit　board　(PCB)　assembly.　Stencil　printing　behavior　is　affected　by　many　variables　including　stencil　design,　solder　paste　composition,　squeegee　speed　and　pressure,　and　other　environmental　conditions.　In　this　research,　support　vector　regression　(SVR)　model　is　trained　to　capture　the　complex　relationships　among　these　variables,　based　on　historical　data.　A　mixed-integer　linear　programming　(MILP)　model　is　proposed　to　minimize　the　total　absolute　predicted　deviation　of　average　volume　transfer　from　target.　The　optimal　printing　settings　are　retrieved　for　different　sample　problems　with　low　computational　cost.　(C)　2017　The　Authors.　Published　by　Elsevier　B.V.