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author:

Kuo, D.S. (Kuo, D.S..) [1] | Lam, K.T. (Lam, K.T..) [2] | Wen, K.H. (Wen, K.H..) [3] | Chang, S.J. (Chang, S.J..) [4] | Ko, T.K. (Ko, T.K..) [5] | Hon, S.J. (Hon, S.J..) [6]

Indexed by:

EI

Abstract:

The authors propose a simple Ar plasma treatment method to selectively damage the area underneath p-pad electrode of GaN-based light-emitting diodes (LEDs). It was found that we could form a highly resistive area so that the injected carriers will be forced to spread out horizontally for the LED. Under 20 mA current injection, it was found that the output powers were 16.0, 17.9 and 17.3 mW while the forward voltages were 3.17, 3.19 and 3.20 V for conventional LED and LED with SiO2 layer, respectively. Moreover, the LED with Ar plasma treatment is superior to the other LEDs while operating at a higher injection current. © 2011 Elsevier Ltd. All rights reserved.

Keyword:

Argon Gallium nitride III-V semiconductors Light emitting diodes Plasma applications Plasma theory Silica

Community:

  • [ 1 ] [Kuo, D.S.]Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan
  • [ 2 ] [Lam, K.T.]College of Physics and Information Engineering, Fuzhou University, Fuzhou, Fujian 350108, China
  • [ 3 ] [Wen, K.H.]College of Physics and Information Engineering, Fuzhou University, Fuzhou, Fujian 350108, China
  • [ 4 ] [Chang, S.J.]Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan
  • [ 5 ] [Ko, T.K.]Epistar Corporation, Nitride Device Research and Development Center, Hsin-Shi, Tainan 744, Taiwan
  • [ 6 ] [Hon, S.J.]Epistar Corporation, Nitride Device Research and Development Center, Hsin-Shi, Tainan 744, Taiwan

Reprint 's Address:

  • [chang, s.j.]department of electrical engineering, advanced optoelectronic technology center, national cheng kung university, tainan 70101, taiwan

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Source :

Materials Science in Semiconductor Processing

ISSN: 1369-8001

Year: 2012

Issue: 1

Volume: 15

Page: 52-55

1 . 3 3 8

JCR@2012

4 . 2 0 0

JCR@2023

JCR Journal Grade:2

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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