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author:

Dai, P.Q. (Dai, P.Q..) [1] | He, Z.R. (He, Z.R..) [2] | Zheng, C.M. (Zheng, C.M..) [3] | Mao, Z.Y. (Mao, Z.Y..) [4]

Indexed by:

EI

Abstract:

The microprocesses of crack initiation and propagation in an austempered ductile iron have been investigated by using an scanning electron microscope with a microtensile holder. It was revealed that microcracks always initiated at, and propagated along, the graphite-matrix interface. Microcracks in the matrix initiated after the interface cracking. The graphite nodules in this cast iron could not be regarded as voids with no strength because internal fracture of the graphite was observed. When the cracks propagated in the matrix, they often grew along the bainitic ferrite-austenite interface. Crack deflection, shear ligament formation, and crack branching occured during the connection of main cracks and microcracks, which contributed to the strength and toughness of the ADI. © 2001 Elsevier Science B.V. All rights reserved.

Keyword:

Austenite Bainite Cast iron Crack initiation Crack propagation Ductile fracture Ferrite Graphite Interfaces (materials) Microcracks Scanning electron microscopy

Community:

  • [ 1 ] [Dai, P.Q.]School of Materials Science and Engineering, Fuzhou University, Fuzhou 350002, China
  • [ 2 ] [Dai, P.Q.]Department of Materials Science and Engineering, Zhejiang University, Hangzhou 10027, China
  • [ 3 ] [He, Z.R.]School of Materials Science and Engineering, Fuzhou University, Fuzhou 350002, China
  • [ 4 ] [Zheng, C.M.]School of Materials Science and Engineering, Fuzhou University, Fuzhou 350002, China
  • [ 5 ] [Mao, Z.Y.]Department of Materials Science and Engineering, Zhejiang University, Hangzhou 10027, China

Reprint 's Address:

  • [dai, p.q.]department of materials science and engineering, zhejiang university, hangzhou 10027, china;;[dai, p.q.]school of materials science and engineering, fuzhou university, fuzhou 350002, china

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Source :

Materials Science and Engineering A

ISSN: 0921-5093

Year: 2001

Volume: 319-321

Page: 531-534

0 . 9 7 8

JCR@2001

6 . 1 0 0

JCR@2023

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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