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High-speed scanning is an effective way to improve the throughput of immersion lithography with double patterning, especially when the critical dimension is less than 32-nm. But it makes more complex characteristics of immersion flow. In this paper, considering the extreme speed of wafer scanning, the model is developed to investigate the characteristics of immersion flow, including the velocity vector, pressure distribution, renovation efficiency and so on. Finally, the optimized parameters and methods to effective liquid renovation are proposed when the wafer scans at high-speed. © (2013) Trans Tech Publications, Switzerland.
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ISSN: 1022-6680
Year: 2013
Volume: 622
Page: 869-872
Language: English
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ESI Highly Cited Papers on the List: 0 Unfold All
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30 Days PV: 1
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