The　strengthening　effects　of　the　Cu-80　wt.%　W　(CuW80)　alloy　and　the　copper　parts　in　Cu-80wt.%　W　/Cu　(CuW80/Cu)　solid　contact　alloy,　which　was　sintered　and　infiltrated　prepared　by　powder　metallurgy,　were　investigated.　The　effects　of　different　compressive　deformation　on　microstructure　and　properties　of　the　CuW80　were　studied.　Furthermore,　the　influences　of　HextrusionH　on　copper　parts,　the　carrier　material　of　the　solid　contact　alloy　CuW80/Cu　were　also　investigated.　The　results　show　that　the　tungsten　and　copper　phases　are　closely　bonded　by　physical　bond　in　the　form　of　pseudo-alloy　and　the　copper　phase　is　homogeneously　dispersed　within　the　tungsten　framework.　The　hardness　of　the　CuW80　increases　with　increasing　compressive　deformation.　Especially,　the　hardness　of　the　copper　parts　in　CuW80/Cu　increases　remarkably　after　extrusion　and　the　maximum　value　can　reach　200%.　The　hardness　increases　from　the　inner　to　the　surface　and　is　proportional　to　the　distance　departing　from　the　interface　of　the　CuW80　and　Cu.　TEM　observation　shows　that　the　dislocation　tangles　exist,　even　inside　the　dislocation　cell,　in　copper　grains　after　extrusion.