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author:

吴本生 (吴本生.) [1] | 杨晓华 (杨晓华.) [2] (Scholars:杨晓华) | 陈文哲 (陈文哲.) [3]

Abstract:

本文介绍了无铅焊接技术的现状以及国内外对Sn-Ag和Sn-Zn等二元无铅焊料的研究成果,以及无铅焊接的几种常见技术.

Keyword:

微电子封装 无铅焊接

Community:

  • [ 1 ] [吴本生]福州大学材料科学与工程学院(福州)
  • [ 2 ] [杨晓华]福州大学材料科学与工程学院(福州)
  • [ 3 ] [陈文哲]福州大学材料科学与工程学院(福州)

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Source :

Year: 2005

Page: 77-81

Language: Chinese

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 0

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