• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
成果搜索

author:

吴本生 (吴本生.) [1] | 杨晓华 (杨晓华.) [2] (Scholars:杨晓华) | 陈文哲 (陈文哲.) [3]

Indexed by:

CQVIP

Abstract:

介绍了无铅焊接技术的现状以及国内外对Sn-Ag和Sn-Zn等二元无铅焊料的研究成果,以及无铅焊接的几种常见技术.

Keyword:

发展现状 微电子封装 无铅焊接

Community:

  • [ 1 ] [吴本生]福州大学
  • [ 2 ] [杨晓华]福州大学
  • [ 3 ] [陈文哲]福州大学

Reprint 's Address:

Email:

Show more details

Version:

Related Keywords:

Source :

理化检验-物理分册

ISSN: 1001-4012

CN: 31-1338/TB

Year: 2005

Issue: z1

Volume: 41

Page: 77-81

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

Online/Total:180/10041228
Address:FZU Library(No.2 Xuyuan Road, Fuzhou, Fujian, PRC Post Code:350116) Contact Us:0591-22865326
Copyright:FZU Library Technical Support:Beijing Aegean Software Co., Ltd. 闽ICP备05005463号-1