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author:

杨开怀 (杨开怀.) [1] | 黄友庭 (黄友庭.) [2] | 陈文哲 (陈文哲.) [3]

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CQVIP PKU CSCD

Abstract:

研究了粉末冶金熔渗烧结法制备的CuW80/Cu整体式触头材料尾部铜经挤压变形后硬度的变化规律,并用三维视频显微镜和透射电镜进行显微组织结构分析.结果表明:尾部铜经挤压变形后,硬度显著提高,增幅约200%,挤压工艺是CuW80/Cu整体式触头材料尾部铜强化处理的有效手段.尾部铜沿横截面从芯部到表面,越接近表面,其硬度值越大;沿纵截面,从CuW80/Cu界面到末端,硬度提高.即使挤压变形很小,尾部铜仍产生了位错缠结,挤压严重部分产生大量位错胞组织.

Keyword:

CuW80/Cu 位错 挤压强化 整体式触头材料 显微硬度

Community:

  • [ 1 ] [杨开怀]福州大学
  • [ 2 ] [黄友庭]福州大学
  • [ 3 ] [陈文哲]福州大学

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Source :

机械工程材料

ISSN: 1000-3738

CN: 31-1336/TB

Year: 2007

Issue: 4

Volume: 31

Page: 43-47

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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