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研究了工艺条件对Ni-P-金刚石化学复合镀镀速及镀层中金刚石含量的影响,并探讨了复合镀层的沉积机理.结果表明:温度、pH值升高,镀速迅速增加,改变金刚石加入量对镀速的影响很小;镀层金刚石含量受温度影响较小,而随pH值增加先增后减.随金刚石加入量的增加,镀层金刚石含量先是迅速增加,以后增加趋势越来越缓慢,两者呈抛物线型关系.金刚石表面ζ电位为负值,表明金刚石没有吸附镀液中的正离子,其颗粒的吸附不是依靠电场力作用,而主要是依靠机械力的作用.
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材料保护
ISSN: 1001-1560
CN: 42-1215/TB
Year: 2002
Issue: 9
Volume: 35
Page: 22-24
Cited Count:
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 2
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