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author:

Hua, Wenqiang (Hua, Wenqiang.) [1] | Lin, Qilang (Lin, Qilang.) [2] (Scholars:林起浪) | Qu, Bo (Qu, Bo.) [3] | Zheng, Yanyu (Zheng, Yanyu.) [4] | Liu, Xiaoying (Liu, Xiaoying.) [5] | Li, Wenjie (Li, Wenjie.) [6] | Zhao, Xiaojing (Zhao, Xiaojing.) [7] | Chen, Shaoyun (Chen, Shaoyun.) [8] | Zhuo, Dongxian (Zhuo, Dongxian.) [9]

Indexed by:

EI SCIE

Abstract:

Photosensitive resins used in three-dimensional (3D) printing are characterized by high forming precision and fast processing speed; however, they often possess poor mechanical properties and heat resistance. In this study, we report a photocurable bismaleimide ink with excellent comprehensive performance for stereolithography (SLA) 3D printing. First, the main chain of bismaleimide with an amino group (BDM) was synthesized, and then, the glycidyl methacrylate was grafted to the amino group to obtain the bismaleimide oligomer with an unsaturated double bond. The oligomers were combined with reaction diluents and photo-initiators to form photocurable inks that can be used for SLA 3D printing. The viscosity and curing behavior of the inks were studied, and the mechanical properties and heat resistance were tested. The tensile strength of 3D-printed samples based on BDM inks could reach 72.6 MPa (166% of that of commercial inks), glass transition temperature could reach 155 degrees C (205% of that of commercial inks), and energy storage modulus was 3625 MPa at 35 degrees C (327% of that of commercial inks). The maximum values of T-5%, T-50%, and T-max of the 3D samples printed by BDM inks reached 351.5, 449.6, and 451.9 degrees C, respectively. These photocured BDM inks can be used to produce complex structural components and models with excellent mechanical and thermal properties, such as car parts, building models, and pipes.

Keyword:

3D printing bismaleimide resin mechanical properties thermal properties

Community:

  • [ 1 ] [Hua, Wenqiang]Fuzhou Univ, Coll Mat Sci & Engn, Fuzhou 350108, Peoples R China
  • [ 2 ] [Lin, Qilang]Fuzhou Univ, Coll Mat Sci & Engn, Fuzhou 350108, Peoples R China
  • [ 3 ] [Hua, Wenqiang]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China
  • [ 4 ] [Qu, Bo]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China
  • [ 5 ] [Zheng, Yanyu]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China
  • [ 6 ] [Liu, Xiaoying]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China
  • [ 7 ] [Li, Wenjie]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China
  • [ 8 ] [Zhao, Xiaojing]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China
  • [ 9 ] [Chen, Shaoyun]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China
  • [ 10 ] [Zhuo, Dongxian]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China

Reprint 's Address:

  • [Chen, Shaoyun]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China;;[Zhuo, Dongxian]Quanzhou Normal Univ, Coll Chem Engn & Mat Sci, Quanzhou 362000, Peoples R China

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Source :

MATERIALS

ISSN: 1996-1944

Year: 2021

Issue: 7

Volume: 14

3 . 7 4 8

JCR@2021

3 . 1 0 0

JCR@2023

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:142

JCR Journal Grade:1

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 12

SCOPUS Cited Count: 13

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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