Photosensitive　resins　used　in　threedimensional　(3D)　printing　are　characterized　by　high　forming　precision　and　fast　processing　speed;　however,　they　often　possess　poor　mechanical　properties　and　heat　resistance.　In　this　study,　we　report　a　photocurable　bismaleimide　ink　with　excellent　comprehensive　performance　for　stereolithography　(SLA)　3D　printing.　First,　the　main　chain　of　bismaleimide　with　an　amino　group　(BDM)　was　synthesized,　and　then,　the　glycidyl　methacrylate　was　grafted　to　the　amino　group　to　obtain　the　bismaleimide　oligomer　with　an　unsaturated　double　bond.　The　oligomers　were　combined　with　reaction　diluents　and　photoinitiators　to　form　photocurable　inks　that　can　be　used　for　SLA　3D　printing.　The　viscosity　and　curing　behavior　of　the　inks　were　studied,　and　the　mechanical　properties　and　heat　resistance　were　tested.　The　tensile　strength　of　3Dprinted　samples　based　on　BDM　inks　could　reach　72.6　MPa　(166%　of　that　of　commercial　inks),　glass　transition　temperature　could　reach　155　°C　(205%　of　that　of　commercial　inks),　and　energy　storage　modulus　was　3625　MPa　at　35　°C　(327%　of　that　of　commercial　inks).　The　maximum　values　of　T5%,　T50%,　and　Tmax　of　the　3D　samples　printed　by　BDM　inks　reached　351.5,　449.6,　and　451.9　°C,　respectively.　These　photocured　BDM　inks　can　be　used　to　produce　complex　structural　components　and　models　with　excellent　mechanical　and　thermal　properties,　such　as　car　parts,　building　models,　and　pipes.　©　2021　by　the　authors.　Licensee　MDPI,　Basel,　Switzerland.